SBOK090A January 2025 – April 2025 THVD9491-SEP
PRODUCTION DATA
3 Test Device and Test Board Information
The THVD9491-SEP is a packaged 14-pin, SOIC plastic package as shown in the pinout diagram in Figure 3-2. Figure 3-3 shows the device with the package decapped to reveal the die for heavy ion testing. shows the evaluation board used for radiation testing. Figure 3-4 shows the bias diagram used for Single-Event Latch-up (SEL) testing. A thermal camera image used to verify accurate temperature recordings for SEL testing at 125°C.
Figure 3-1 THVD9491-SEP Pinout
Diagram
Figure 3-2 THVD9491-SEP Pinout
Diagram
Figure 3-3 THVD9491-SEP with Decapped
Package
Figure 3-4 THVD9491-SEP SEL Bias
Diagram 1
Figure 3-5 THVD9491-SEP SEL Bias
Diagram 2
Figure 3-6 THVD9491-SEP SET Bias Diagram
1
Figure 3-7 THVD9491-SEP SET Bias Diagram
2