ZHCSR45D September   2010  – October 2022 TS3L501E

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics for 1000 Base-T Ethernet Switching
    6. 6.6 Electrical Characteristics for 10/100 Base-T Ethernet Switching
    7. 6.7 Switching Characteristics
    8. 6.8 Dynamic Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Enable and Disable Times
    2. 7.2 Skew
    3. 7.3 HP8753ES Setup
    4. 7.4 HP8753ES Setup
    5. 7.5 HP8753ES Setup
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VDDSupply voltage33.6V
VIHHigh-level control input voltage (SEL)25.5V
VILLow-level control input voltage (SEL)00.8V
VINInput voltage (SEL)05.5V
VI/OInput or output voltage0VDDV
TAOperating free-air temperature–4085°C
(1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004.