ZHCSIS8F September   2018  – March 2024 TPS7H2201-SEP , TPS7H2201-SP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: CFP and KGD Options
    7. 6.7  Electrical Characteristics: HTSSOP Option
    8. 6.8  Switching Characteristics (All Devices)
    9. 6.9  Quality Conformance Inspection
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable, Undervoltage, and Overvoltage Protection
      2. 8.3.2 Adjustable Rise Time
      3. 8.3.3 Programmable Current Limiting
      4. 8.3.4 Programmable Fault Timer
      5. 8.3.5 Current Sense
      6. 8.3.6 Parallel Operation
      7. 8.3.7 Reverse Current Protection
      8. 8.3.8 Forward Leakage Current
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Redundancy
      2. 9.2.2 Protection
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
        1. 9.2.4.1 Undervoltage Lockout
        2. 9.2.4.2 Overvoltage Protection
        3. 9.2.4.3 Current Limit
        4. 9.2.4.4 Programmable Fault Timers
        5. 9.2.4.5 Soft Start Time
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DAP|32
  • KGD|0
  • HKR|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1) TPS7H2201-SP TPS7H2201-SEP UNIT
HKR (CFP) DAP (HTSSOP)
16 PINS 32 PINS
RθJA Junction-to-ambient thermal resistance 72.3 23.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 96.1 11.2
RθJB Junction-to-board thermal resistance 42.1 5.4
ψJT Junction-to-top characterization parameter 3.3 0.1
ψJB Junction-to-board characterization parameter 42.5 5.4
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6 0.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.