ZHCSIS8F 数据表 | 德州仪器 TI.com.cn

ZHCSIS8F September 2018 – March 2024 TPS7H2201-SEP , TPS7H2201-SP

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

DAP|32
KGD|0
HKR|16

散热焊盘机械数据 (封装 | 引脚)

DAP|32
- PPTD390

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6.10 Typical Characteristics

I_IL = 7.5 A

Figure 6-1 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 1.5 V

I_IL = 7.5 A

Figure 6-3 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 7 V

I_IL = 7.5 A

Figure 6-5 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 5 V

Figure 6-7 RTIMER Pull-Down Resistance vs Temperature Across VIN

Figure 6-9 I_Q vs Temperature Across VIN

Figure 6-11 I_RCP vs Temperature With EN = GND

Figure 6-13 ILTIMER Charge Current vs Temperature Across VIN

Figure 6-15 SS Charge Current vs Temperature Across VIN

EN pin driven directly

Figure 6-17 V_ILEN vs Temperature Across VIN

OVP pin driven directly

Figure 6-19 V_OVPF vs Temperature Across VIN

Figure 6-21 SS Slew Rate vs SS Capacitor Across Temperature

I_IL = 7.5 A

Figure 6-2 On-Resistance vs Temperature Across Loads for CFP and KGD at VIN = 5 V

I_IL = 7.5 A

Figure 6-4 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 1.5 V

I_IL = 7.5 A

Figure 6-6 On-Resistance vs Temperature Across Loads for HTSSOP at VIN = 7 V

Figure 6-8 ILTIMER Pull-Down Resistance vs Temperature Across VIN

Figure 6-10 I_RCP vs Temperature With EN = 7 V

Figure 6-12 I_SD VIN vs Temperature Across VIN

Figure 6-14 RTIMER Charge Current vs Temperature Across VIN

EN pin driven directly

Figure 6-16 V_IHEN vs Temperature Across VIN

OVP pin driven directly
Waveform at 3.3 V is obscured by the 5 V

Figure 6-18 V_OVPR vs Temperature Across VIN

Figure 6-20 I_IL vs R_IL Across Temperature