ZHCSIS8F September   2018  – March 2024 TPS7H2201-SEP , TPS7H2201-SP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Options
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: All Devices
    6. 6.6  Electrical Characteristics: CFP and KGD Options
    7. 6.7  Electrical Characteristics: HTSSOP Option
    8. 6.8  Switching Characteristics (All Devices)
    9. 6.9  Quality Conformance Inspection
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable, Undervoltage, and Overvoltage Protection
      2. 8.3.2 Adjustable Rise Time
      3. 8.3.3 Programmable Current Limiting
      4. 8.3.4 Programmable Fault Timer
      5. 8.3.5 Current Sense
      6. 8.3.6 Parallel Operation
      7. 8.3.7 Reverse Current Protection
      8. 8.3.8 Forward Leakage Current
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Redundancy
      2. 9.2.2 Protection
      3. 9.2.3 Design Requirements
      4. 9.2.4 Detailed Design Procedure
        1. 9.2.4.1 Undervoltage Lockout
        2. 9.2.4.2 Overvoltage Protection
        3. 9.2.4.3 Current Limit
        4. 9.2.4.4 Programmable Fault Timers
        5. 9.2.4.5 Soft Start Time
      5. 9.2.5 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DAP|32
  • KGD|0
  • HKR|16
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

HKR Package DAP Package
16-Pin CFP With Thermal Pad 32-Pin HTSSOP With Thermal Pad
Top View Top View
GUID-47785CD7-1EA6-4DC7-8160-94A3FF281449-low.svg GUID-20230126-SS0I-V1BX-SJLV-MWRX16NHGGRB-low.svg
Table 5-1 Pin Functions
PIN I/O(1) DESCRIPTION
HKR (16) NO. PW (32) NO. NAME
1-4 1-10 VIN I Switch input. Input bypass capacitor recommended for minimizing VIN dip.
5 11 CS O Current sense pin proportional to output current. Connect a resistor to GND.
6 12 EN I Active high switch control input. Do not leave floating.
7 13 OVP I Overvoltage protection. Programmable using an external resistor divider. If no OVP is desired, this pin should be connected to GND.
8 15 GND — Device ground. (2)
9 18 RTIMER I/O Capacitor programmed fault timer control during disabled and retry mode. Connecting this pin to GND holds the switch disabled until the EN pin is cycled. Do not float this pin or connect it to VIN.
10 20 IL I/O Current limiter control. Programmable using an external resistor to GND. Do not float this pin.
11 21 ILTIMER I Capacitor programmed fault timer control during current limiting mode. Connecting this pin to VIN uses the internal current limit timer and connecting this pin to GND disables the internal timer functionality for the ILTIMER as well as retry mode. In this case, the device will remain at programmed current limit indefinitely in the event of a short without going intro retry mode. Do not float this pin.
12 22 SS I/O Switch slew rate control. See the Section 8.3.2 section for more information.
13-16 23-32 VOUT O Switch output. A minimum 10-µF output capacitor is recommended.
14,16,17,19 NC — No connect. This pin is not internally connected. It is recommended to connect these pins to GND to prevent charge buildup; however, these pins can also be left open or tied to any voltage between GND and VIN.
— Thermal Pad — Thermal pad (exposed center pad) for heat dissipation purposes. Thermal pad is internally connected to seal ring and GND.
(1) I = Input, O = Output, I/O = Input or Output, — = Other
(2) Thermal pad is internally connected to the seal ring and GND for HKR option.
Table 5-2 Bare Die Information
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION COMPOSITION BOND PAD THICKNESS
15 mils Silicon with backgrind Ground ALCU 1050 nm
GUID-20230502-SS0I-FWTZ-MBMH-2PJHWDDLZXRJ-low.svg
  1. All dimensions in microns (μm).
  2. The inner rectangle is the die and the outer rectangle is the die plus scribe lines.
Table 5-3 Bond Pad Coordinates in Microns
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
VIN 1 611.78 4976.1 751.73 5116.05
VIN 2 258.17 4976.1 398.12 5116.05
VIN 3 258.17 4809.15 398.12 4949.1
VIN 4 611.78 4809.15 751.73 4949.1
VIN 5 258.17 4641.39 398.12 4781.34
VIN 6 611.78 4641.39 751.73 4781.34
VIN 7 258.17 4473.59 398.12 4613.54
VIN 8 611.78 4473.59 751.73 4613.54
VIN 9 258.17 3647.7 398.12 3787.65
VIN 10 611.78 3647.7 751.73 3787.65
VIN 11 258.17 3480.75 398.12 3620.7
VIN 12 611.78 3480.75 751.73 3620.7
VIN 13 258.17 3312.99 398.12 3452.94
VIN 14 611.78 3312.99 751.73 3452.94
VIN 15 258.17 3145.19 398.12 3285.14
VIN 16 611.78 3145.19 751.73 3285.14
VIN 17 258.17 2315.57 398.12 2455.52
VIN 18 611.78 2315.57 751.73 2455.52
VIN 19 258.17 2146.37 398.12 2286.32
VIN 20 611.78 2146.37 751.73 2286.36
AVDD 21 54.99 1842.03 194.94 1981.98
AVDD 22 54.99 1671.48 194.94 1811.43
CS 23 54.99 1480.77 194.94 1620.72
EN 24 54.99 972.68 194.94 1112.63
OVP 25 54.99 406.26 194.94 546.21
GND 26 407.21 54.99 547.16 194.94
GND 27 577.76 54.99 717.71 194.94
RTIMER 28 2792.88 54.99 2932.83 194.94
IL 29 3315.06 587.43 3455.01 727.38
ILTIMER 30 3315.06 1099.26 3455.01 1239.21
SS 31 3315.06 1544.09 3455.01 1684.04
VOUT 32 3111.66 2146.37 3251.61 2286.32
VOUT 33 2758.05 2146.37 2898 2286.32
VOUT 34 3111.66 2315.57 3251.61 2455.52
VOUT 35 2758.05 2315.57 2898 2455.52
VOUT 36 3111.66 3145.19 3251.61 3285.14
VOUT 37 2758.05 3145.19 2898 3285.14
VOUT 38 3111.66 3312.99 3251.61 3452.94
VOUT 39 2758.05 3312.99 2898 3452.94
VOUT 40 3111.66 3480.75 3251.61 3620.7
VOUT 41 2758.05 3480.75 2898 3620.7
VOUT 42 3111.66 3647.7 3251.61 3787.65
VOUT 43 2758.05 3647.7 2898 3787.65
VOUT 44 3111.66 4473.59 3251.61 4613.54
VOUT 45 2758.05 4473.59 2898 4613.54
VOUT 46 3111.66 4641.39 3251.61 4781.34
VOUT 47 2758.05 4641.39 2898 4781.34
VOUT 48 3111.66 4809.15 3251.61 4949.1
VOUT 49 2758.05 4809.15 2898 4949.1
VOUT 50 3111.66 4976.1 3251.61 5116.05
VOUT 51 2758.05 4976.1 2898 5116.05