SBVS463A October   2025  – December 2025 TPS7E81-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable (EN)
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Undervoltage Lockout
      4. 6.3.4 Thermal Shutdown
      5. 6.3.5 Foldback Current Limit
      6. 6.3.6 Power Limit
      7. 6.3.7 Output Pulldown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Adjustable Device Feedback Resistor Selection
      2. 7.1.2 Recommended Capacitor Types
      3. 7.1.3 Input and Output Capacitor Selection
      4. 7.1.4 Reverse Current
      5. 7.1.5 Feed-Forward Capacitor
      6. 7.1.6 Dropout Voltage
      7. 7.1.7 Estimating Junction Temperature
      8. 7.1.8 Power Dissipation (PD)
      9. 7.1.9 Power Dissipation Versus Ambient Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Choose Feedback Resistors
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
        2. 8.1.1.2 Spice Models
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

Pin Configuration and Functions

Figure 4-1 DRV Package (Fixed/ADJ),6-Pin WSON(Top View)
Figure 4-3 DBV Package, (Fixed/ADJ),
5-Pin SOT-23(Top View)
Figure 4-5 DGN Package (Fixed/ADJ),
8-Pin HVSSOP(Top View)
Figure 4-2 DRV Package, A-version (Fixed/ADJ),
6-Pin WSON(Top View)
Figure 4-4 DBV Package, [A-version, w/o EN] (Fixed/ADJ),
5-Pin SOT-23(Top View)
Table 4-1 Pin Functions
PIN DESCRIPTION
NAME TYPE
GND Ground pin.
IN Input Input supply pin. See the Recommended Operating Conditions table and the Input and Output Capacitor Selection section for more information.
OUT Output Output of the regulator. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
EN Input Enable pin. Driving the enable pin high enables the device. Driving this pin low disables the device. High and low thresholds are listed in the Electrical Characteristics table. This pin has a weak internal pullup and can be left floating to enable the device or the pin can be connected to the input pin. Refer to Enable (EN) section.
ADJ Input When using the adjustable device, this pin sets the output voltage with the help of a feedback divider. In the adjustable configuration, this pin must be connected through a resistor divider to the output for the device to function.
NC Not internally connected. Leave this pin open or connected to any potential. Tie this pin to ground for improved thermal performance.
Thermal pad Thermal pad. Connect the pad to GND for the best possible thermal performance. See the Layout section for more information.