ZHCSNX8B December   2020  – September 2023 TPS6593-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
    1.     5
  5. Revision History
  6. 说明(续)
  7. Pin Configuration and Functions
    1. 6.1 Digital Signal Descriptions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Purpose Low Drop-Out Regulators (LDO1, LDO2, LDO3)
    6. 7.6  Low Noise Low Drop-Out Regulator (LDO4)
    7. 7.7  Internal Low Drop-Out Regulators (LDOVRTC, LDOVINT)
    8. 7.8  BUCK1, BUCK2, BUCK3, BUCK4 and BUCK5 Regulators
    9. 7.9  Reference Generator (BandGap)
    10. 7.10 Monitoring Functions
    11. 7.11 Clocks, Oscillators, and PLL
    12. 7.12 Thermal Monitoring and Shutdown
    13. 7.13 System Control Thresholds
    14. 7.14 Current Consumption
    15. 7.15 Backup Battery Charger
    16. 7.16 Digital Input Signal Parameters
    17. 7.17 Digital Output Signal Parameters
    18. 7.18 I/O Pullup and Pulldown Resistance
    19. 7.19 I2C Interface
    20. 7.20 Serial Peripheral Interface (SPI)
    21. 7.21 Typical Characteristics
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Supply Voltage Monitor
      2. 8.3.2  Power Resources (Bucks and LDOs)
        1. 8.3.2.1 Buck Regulators
          1. 8.3.2.1.1  BUCK Regulator Overview
          2. 8.3.2.1.2  Multi-Phase Operation and Phase-Adding or Shedding
          3. 8.3.2.1.3  Transition Between PWM and PFM Modes
          4. 8.3.2.1.4  Multi-Phase BUCK Regulator Configurations
          5. 8.3.2.1.5  Spread-Spectrum Mode
          6. 8.3.2.1.6  Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          7. 8.3.2.1.7  BUCK Output Voltage Setting
          8. 8.3.2.1.8  BUCK Regulator Current Limit
          9. 8.3.2.1.9  SW_Bx Short-to-Ground Detection
          10. 8.3.2.1.10 Sync Clock Functionality
          11.        49
        2. 8.3.2.2 Low Dropout Regulators (LDOs)
          1. 8.3.2.2.1 LDOVINT
          2. 8.3.2.2.2 LDOVRTC
          3. 8.3.2.2.3 LDO1, LDO2, and LDO3
          4. 8.3.2.2.4 Low-Noise LDO (LDO4)
      3. 8.3.3  Output Voltage Monitor and PGOOD Generation
      4. 8.3.4  Thermal Monitoring
        1. 8.3.4.1 Thermal Warning Function
        2. 8.3.4.2 Thermal Shutdown
      5. 8.3.5  Backup Supply Power-Path
      6. 8.3.6  General-Purpose I/Os (GPIO Pins)
      7. 8.3.7  nINT, EN_DRV, and nRSTOUT Pins
      8. 8.3.8  Interrupts
      9. 8.3.9  RTC
        1. 8.3.9.1 General Description
        2. 8.3.9.2 Time Calendar Registers
          1. 8.3.9.2.1 TC Registers Read Access
          2. 8.3.9.2.2 TC Registers Write Access
        3. 8.3.9.3 RTC Alarm
        4. 8.3.9.4 RTC Interrupts
        5. 8.3.9.5 RTC 32-kHz Oscillator Drift Compensation
      10. 8.3.10 Watchdog (WDOG)
        1. 8.3.10.1 Watchdog Fail Counter and Status
        2. 8.3.10.2 Watchdog Start-Up and Configuration
        3. 8.3.10.3 MCU to Watchdog Synchronization
        4. 8.3.10.4 Watchdog Disable Function
        5. 8.3.10.5 Watchdog Sequence
        6. 8.3.10.6 Watchdog Trigger Mode
        7. 8.3.10.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       79
        9. 8.3.10.8 Watchdog Question-Answer Mode
          1. 8.3.10.8.1 Watchdog Q&A Related Definitions
          2. 8.3.10.8.2 Question Generation
          3. 8.3.10.8.3 Answer Comparison
            1. 8.3.10.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 8.3.10.8.3.2 Watchdog Sequence Events and Status Updates
            3. 8.3.10.8.3.3 Watchdog Q&A Sequence Scenarios
      11. 8.3.11 Error Signal Monitor (ESM)
        1. 8.3.11.1 ESM Error-Handling Procedure
          1. 8.3.11.1.1 Level Mode
          2.        90
          3. 8.3.11.1.2 PWM Mode
            1. 8.3.11.1.2.1 Good-Events and Bad-Events
            2. 8.3.11.1.2.2 ESM Error-Counter
            3. 8.3.11.1.2.3 ESM Start-Up in PWM Mode
            4. 8.3.11.1.2.4 ESM Flow Chart and Timing Diagrams in PWM Mode
            5.         96
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device State Machine
        1. 8.4.1.1 Fixed Device Power FSM
          1. 8.4.1.1.1 Register Resets and NVM Read at INIT State
        2. 8.4.1.2 Pre-Configurable Mission States
          1. 8.4.1.2.1 PFSM Commands
            1. 8.4.1.2.1.1  REG_WRITE_IMM Command
            2. 8.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 8.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 8.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 8.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 8.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 8.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 8.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 8.4.1.2.1.9  SREG_READ_REG Command
            10. 8.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 8.4.1.2.1.11 WAIT Command
            12. 8.4.1.2.1.12 DELAY_IMM Command
            13. 8.4.1.2.1.13 DELAY_SREG Command
            14. 8.4.1.2.1.14 TRIG_SET Command
            15. 8.4.1.2.1.15 TRIG_MASK Command
            16. 8.4.1.2.1.16 END Command
          2. 8.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 8.4.1.2.3 Mission State Configuration
          4. 8.4.1.2.4 Pre-Configured Hardware Transitions
            1. 8.4.1.2.4.1 ON Requests
            2. 8.4.1.2.4.2 OFF Requests
            3. 8.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 8.4.1.2.4.4 WKUP1 and WKUP2 Functions
            5. 8.4.1.2.4.5 LP_WKUP Pins for Waking Up from LP STANDBY
        3. 8.4.1.3 Error Handling Operations
          1. 8.4.1.3.1 Power Rail Output Error
          2. 8.4.1.3.2 Catastrophic Error
          3. 8.4.1.3.3 Watchdog (WDOG) Error
          4. 8.4.1.3.4 Warnings
        4. 8.4.1.4 Device Start-up Timing
        5. 8.4.1.5 Power Sequences
        6. 8.4.1.6 First Supply Detection
        7. 8.4.1.7 Register Power Domains and Reset Levels
      2. 8.4.2 Multi-PMIC Synchronization
        1. 8.4.2.1 SPMI Interface System Setup
        2. 8.4.2.2 Transmission Protocol and CRC
          1. 8.4.2.2.1 Operation with Transmission Errors
          2. 8.4.2.2.2 Transmitted Information
        3. 8.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 8.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 8.4.2.4 SPMI-BIST Overview
          1. 8.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 8.4.2.4.2 Periodic Checking of the SPMI
          3. 8.4.2.4.3 SPMI Message Priorities
    5. 8.5 Control Interfaces
      1. 8.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 数据有效性
        2. 8.5.2.2 启动和停止条件
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 Auto-Increment Feature
      3. 8.5.3 Serial Peripheral Interface (SPI)
    6. 8.6 Configurable Registers
      1. 8.6.1 Register Page Partitioning
      2. 8.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.6.3 CRC Protection for User Registers
      4. 8.6.4 Register Write Protection
        1. 8.6.4.1 Watchdog and ESM Configuration Registers
        2. 8.6.4.2 User Registers
    7. 8.7 Register Maps
      1. 8.7.1 TPS6593-Q1 Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Powering a Processor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VCCA
          2. 9.2.1.2.2 Internal LDOs
          3. 9.2.1.2.3 Crystal Oscillator
          4. 9.2.1.2.4 Buck Input Capacitors
          5. 9.2.1.2.5 Buck Output Capacitors
          6. 9.2.1.2.6 Buck Inductors
          7. 9.2.1.2.7 LDO Input Capacitors
          8. 9.2.1.2.8 LDO Output Capacitors
          9. 9.2.1.2.9 Digital Signal Connections
      2. 9.2.2 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 第三方产品免责声明
    2. 10.2 Device Nomenclature
    3. 10.3 Documentation Support
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 支持资源
    6. 10.6 Trademarks
    7. 10.7 静电放电警告
    8. 10.8 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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Transferring Data

Every byte put on the SDA line must be eight bits long, with the most significant bit (MSB) being transferred first. Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated by the controller device. The controller device releases the SDA line (HIGH) during the acknowledge clock pulse. The device pulls down the SDA line during the 9th clock pulse, signifying an acknowledge. The device generates an acknowledge after each byte has been received.

There is one exception to the acknowledge after every byte rule. When the controller device is the receiver, it must indicate to the transmitter an end of data by not-acknowledging (negative acknowledge) the last byte clocked out of the target device. This negative acknowledge still includes the acknowledge clock pulse (generated by the controller device), but the SDA line is not pulled down.

After the START condition, the bus controller device sends a chip address. This address is seven bits long followed by an eighth bit which is a data direction bit (READ or WRITE). For the eighth bit, a 0 indicates a WRITE and a 1 indicates a READ. The second byte selects the register to which the data is written. The third byte contains data to write to the selected register. Figure 8-53 shows an example bit format of device address 110000-Bin = 60Hex.

GUID-20220113-SS0I-R7CM-XC5S-8D0FH5LZ2H25-low.svg Figure 8-53 Example Device Address

For safety applications, the device supports read and write protocols with embedded CRC data fields. In a write cycle, the I2C controller device (the MCU) must provide the 8-bit CRC value after sending the write data bits and receiving the ACK from the target (the TPS6593-Q1 PMIC). The CRC value must be calculated from every bit included in the write protocol except the ACK bits from the target. See CRC Calculation for I2C and SPI Interface Protocols. In a read cycle, the I2C target must provide the 8-bit CRC value after sending the read data bits and the ACK bit, and expect to receive the NACK from the controller at the end of the protocol. The CRC value must be calculated from every bit included in the read protocol except the ACK and NACK bits. See CRC Calculation for I2C and SPI Interface Protocols.

Note: If I2C CRC is enabled in the device and an I2C write without R_CRC bits is done, the device does not process the write request. The device does not set any interrupt bit and does not pull the nINT pin low.

The embedded CRC field can be enabled or deactivated from the protocol by setting the I2C1_SPI_CRC_EN register bit to '1' - enabled, '0' - deactivated. The default of this bit is configurable through the NVM.

In case the calculated CRC-value does not match the received CRC-check-sum, an I2C-CRC-error is detected, the COMM_CRC_ERR_INT bit is set, unless it is masked by the COMM_CRC_ERR_MASK bit. The MCU must clear this bit by writing a ‘1’ to the COMM_CRC_ERR_INT bit.

When the CRC field is enabled, in the case when MCU attempts to write to a read-only register or a register-address that does not exist, the device sets the COMM_ADR_ERR_INT bit, unless the COMM_ADR_ERR_MASK bit is set. The MCU must clear this bit by writing a ‘1’ to the COMM_ADR_ERR_INT bit.

GUID-AD2BC39D-4360-424C-BD48-53D67BD95B50-low.svgFigure 8-54 I2C Write Cycle without CRC
GUID-96268CE6-FA68-4F24-9C89-F70036E44557-low.svg
The I2C controller device (the MCU) provides R_CRC[7:0], which is calculated from the I2C_ID, R/W, ADDR, and the WDATA bits (24 bits). See CRC Calculation for I2C and SPI Interface Protocols.
Figure 8-55 I2C Write Cycle with CRC
GUID-62C44345-68BD-459A-A8C0-B86254F588EA-low.svg
When READ function is to be accomplished, a WRITE function must precede the READ function as shown above.
Figure 8-56 I2C Read Cycle without CRC
GUID-F684FB08-3415-401D-831C-3F5FFB7356D6-low.svg
The I2C target device (the TPS6593-Q1) provides T_CRC[7:0], which is calculated from the I2C_ID, R/W, ADDR, I2C_ID, R/W, and the RDATA bits (32 bits). See CRC Calculation for I2C and SPI Interface Protocols.
Figure 8-57 I2C READ Cycle with CRC