ZHCSLO0B April   2023  – October 2023 TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6.   Device Options
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - Q100
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS-Control Topology
      2. 8.3.2  Forced-PWM and Power-Save Modes
      3. 8.3.3  Transient Non-Synchronous Mode (optional)
      4. 8.3.4  Precise Enable
      5. 8.3.5  Start-Up
      6. 8.3.6  Switching Frequency Selection
      7. 8.3.7  Output Voltage Setting
        1. 8.3.7.1 Output Voltage Range
        2. 8.3.7.2 Output Voltage Setpoint
        3. 8.3.7.3 Non-Default Output Voltage Setpoint
        4. 8.3.7.4 Dynamic Voltage Scaling
        5. 8.3.7.5 Droop Compensation
      8. 8.3.8  Compensation (COMP)
      9. 8.3.9  Mode Selection / Clock Synchronization (MODE/SYNC)
      10. 8.3.10 Spread Spectrum Clocking (SSC)
      11. 8.3.11 Output Discharge
      12. 8.3.12 Undervoltage Lockout (UVLO)
      13. 8.3.13 Overvoltage Lockout (OVLO)
      14. 8.3.14 Overcurrent Protection
        1. 8.3.14.1 Cycle-by-Cycle Current Limiting
        2. 8.3.14.2 Hiccup Mode
        3. 8.3.14.3 Current-Limit Mode
      15. 8.3.15 Power Good (PG)
        1. 8.3.15.1 Standalone / Primary Device Behavior
        2. 8.3.15.2 Secondary Device Behavior
      16. 8.3.16 Remote Sense
      17. 8.3.17 Thermal Warning and Shutdown
      18. 8.3.18 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
      6. 8.5.6 Dynamic Voltage Scaling (DVS)
    6. 8.6 Device Registers
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Selecting the Input Capacitors
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor CC
        6. 9.2.2.6 Selecting the Compensation Capacitor CC2
      3. 9.2.3 Application Curves
    3. 9.3 Application Using Two TPS62876-Q1 in a Stacked Configuration
      1. 9.3.1 Design Requirements For Two Stacked Devices
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Compensation Resistor
        2. 9.3.2.2 Selecting the Output Capacitors
        3. 9.3.2.3 Selecting the Compensation Capacitor CC
      3. 9.3.3 Application Curves for Two Stacked Devices
    4. 9.4 Application Using Three TPS62876-Q1 in a Stacked Configuration
      1. 9.4.1 Design Requirements For Three Stacked Devices
      2. 9.4.2 Detailed Design Procedure
        1. 9.4.2.1 Selecting the Compensation Resistor
        2. 9.4.2.2 Selecting the Output Capacitors
        3. 9.4.2.3 Selecting the Compensation Capacitor CC
      3. 9.4.3 Application Curves for Three Stacked Devices
    5. 9.5 Best Design Practices
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  13. 11Mechanical, Packaging, and Orderable Information

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6.3 Recommended Operating Conditions

Over operating temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage range 2.7 6 V
VOUT Output voltage range 0.4 1.675 V or  (VIN - 1.5 V)(1) V
Voltage Nominal pull-up voltage on pins SDA and SCL 1.2 5 V
L Effective inductance for fSW = 1.5 MHz 100 150 200 nH
L Effective inductance for fSW = 2.25 MHz, 2.5 MHz and 3 MHz 40 100 200 nH
CIN Effective input capacitance per power input pin 10 22 µF
COUT Effective output capacitance 47 (3) µF
CPAR Parasitic capacitance on FSEL, VSEL pin 100 pF
CPAR Parasitic capacitance on SYNC_OUT pin 20 pF
REN Pull-up resistance on EN pin 15 kΩ
RVSEL, RFSEL Resistance on VSEL, VSEL to GND if not directly tied to GND or VIN 6.2 kΩ
RVSEL, RFSEL Resistance on VSEL, VSEL to VIN if not directly tied to GND or VIN 47 kΩ
RVSEL, RFSEL Resistor tolerance on VSEL, FSEL ± 2%
ISINK_PG Sink current at PG pin 0 1 mA
TJ Operating junction temperature  (2) –40 150 °C
(1) Whatever VOUT value is lower
(2) Operating lifetime is derated at junction temperatures greater than 125 °C.
(3) The maximum recommended output capacitance depends on the specific operating conditions of an application. Output capacitance values of up to a few millifarads are typically possible.