ZHCSLO0B April   2023  – October 2023 TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6.   Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - Q100
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS-Control Topology
      2. 8.3.2  Forced-PWM and Power-Save Modes
      3. 8.3.3  Transient Non-Synchronous Mode (optional)
      4. 8.3.4  Precise Enable
      5. 8.3.5  Start-Up
      6. 8.3.6  Switching Frequency Selection
      7. 8.3.7  Output Voltage Setting
        1. 8.3.7.1 Output Voltage Range
        2. 8.3.7.2 Output Voltage Setpoint
        3. 8.3.7.3 Non-Default Output Voltage Setpoint
        4. 8.3.7.4 Dynamic Voltage Scaling
        5. 8.3.7.5 Droop Compensation
      8. 8.3.8  Compensation (COMP)
      9. 8.3.9  Mode Selection / Clock Synchronization (MODE/SYNC)
      10. 8.3.10 Spread Spectrum Clocking (SSC)
      11. 8.3.11 Output Discharge
      12. 8.3.12 Undervoltage Lockout (UVLO)
      13. 8.3.13 Overvoltage Lockout (OVLO)
      14. 8.3.14 Overcurrent Protection
        1. 8.3.14.1 Cycle-by-Cycle Current Limiting
        2. 8.3.14.2 Hiccup Mode
        3. 8.3.14.3 Current-Limit Mode
      15. 8.3.15 Power Good (PG)
        1. 8.3.15.1 Standalone / Primary Device Behavior
        2. 8.3.15.2 Secondary Device Behavior
      16. 8.3.16 Remote Sense
      17. 8.3.17 Thermal Warning and Shutdown
      18. 8.3.18 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
      6. 8.5.6 Dynamic Voltage Scaling (DVS)
    6. 8.6 Device Registers
  11. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Selecting the Input Capacitors
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor CC
        6. 9.2.2.6 Selecting the Compensation Capacitor CC2
      3. 9.2.3 Application Curves
    3. 9.3 Application Using Two TPS62876-Q1 in a Stacked Configuration
      1. 9.3.1 Design Requirements For Two Stacked Devices
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Compensation Resistor
        2. 9.3.2.2 Selecting the Output Capacitors
        3. 9.3.2.3 Selecting the Compensation Capacitor CC
      3. 9.3.3 Application Curves for Two Stacked Devices
    4. 9.4 Application Using Three TPS62876-Q1 in a Stacked Configuration
      1. 9.4.1 Design Requirements For Three Stacked Devices
      2. 9.4.2 Detailed Design Procedure
        1. 9.4.2.1 Selecting the Compensation Resistor
        2. 9.4.2.2 Selecting the Output Capacitors
        3. 9.4.2.3 Selecting the Compensation Capacitor CC
      3. 9.4.3 Application Curves for Three Stacked Devices
    5. 9.5 Best Design Practices
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 接收文档更新通知
    2. 10.2 支持资源
    3. 10.3 Trademarks
    4. 10.4 静电放电警告
    5. 10.5 术语表
  13. 11Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

Selecting the Output Capacitors

If the converter remains in regulation, the minimum output capacitance required is given by:

Equation 38. COUT(min)(reg)=τ×gm×RZ2×π×LNϕ×fSW41+TOLIND2+TOLfSW2
Equation 39. COUT(min)(reg)=12.5×10-6×1.5×10-3×2.4×1032×π×56×10-93×2.25×10641+20%2+10%2F=835 μF

If the converter loop saturates, the minimum output capacitance is given by:

Equation 40. COUT(min)(sat)=1VOUTLNϕ×IOUT+IL(PP)222×VOUT  IOUT×tt21+TOLIND
Equation 41. COUT(min)(sat)=119.25×10356×1093×46+2.4222×0.875  46×1×10621+20%F = 25.7 μF

In this case, choose COUT(min) = 835 µF, as the larger of the two values, for the output capacitance.

When calculating worst-case component values, use the value calculated above as the minimum output capacitance required. For ceramic capacitors, the nominal capacitance when considering tolerance, DC bias, temperature, and aging effects is typically two times the minimum capacitance. In this case the nominal capacitance is thus 1670 μF.