6.4 Thermal Information
THERMAL METRIC(1)(2) | TPS54622 | UNIT |
RHL (VQFN) |
14 PINS |
RθJA |
Junction-to-ambient thermal resistance |
40.1 |
°C/W |
RθJA |
Junction-to-ambient thermal resistance(3) |
32 |
°C/W |
RθJCtop |
Junction-to-case (top) thermal resistance |
34.4 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
11.4 |
°C/W |
ψJT |
Junction-to-top characterization parameter |
0.5 |
°C/W |
ψJB |
Junction-to-board characterization parameter |
11.4 |
°C/W |
RθJCbot |
Junction-to-case (bottom) thermal resistance |
1.8 |
°C/W |
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below 150°C for best performance and long-term reliability. See the power dissipation estimate in the application section of this datasheet for more information.
(3) Test Board Conditions:
- 2.5 inches × 2.5 inches, 4 layers, thickness: 0.062 inch
- 2 oz. copper traces located on the top of the PCB
- 2 oz. copper ground planes on the 2 internal layers of and the bottom layer
- 4 0.010 inch thermal vias located under the device package