ZHCSNR4B May   2021  – April 2022 TPS25946

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
      1.      15
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.3.2 Active Current Limiting
        3. 8.3.3.3 Short-Circuit Protection
      4. 8.3.4 Analog Load Current Monitor
      5. 8.3.5 Reverse Current Protection
      6. 8.3.6 Overtemperature Protection (OTP)
      7. 8.3.7 Fault Response and Indication (FLT)
      8. 8.3.8 Power Good Indication (PG)
      9. 8.3.9 Input Supply Good Indication (SPLYGD)
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Self-Controlled
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
        2. 9.2.2.2 Setting Overvoltage Threshold
        3. 9.2.2.3 Setting Output Voltage Rise Time (tR)
        4. 9.2.2.4 Setting Power Good Assertion Threshold
        5. 9.2.2.5 Setting Overcurrent Threshold (ILIM)
        6. 9.2.2.6 Setting Overcurrent Blanking Interval (tITIMER)
        7. 9.2.2.7 Selecting External Bias Resistor (R5)
        8. 9.2.2.8 Selecting External Diode (D1)
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
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订购信息

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
VIN Maximum Input Voltage Range, –40℃ ≤ TJ ≤ 125℃ IN –0.3 28 V
VOUT Maximum Output Voltage Range, –40℃ ≤ TJ ≤ 125℃ OUT –0.3 min (28, VIN + 21)
Maximum Output Voltage Range, –10℃ ≤ TJ ≤ 125℃ –0.3 min (28, VIN + 22)
VOUT,PLS Minimum Output Voltage Pulse (< 1 µs) OUT –0.8
VEN/UVLO Maximum Enable Pin Voltage Range EN/UVLO –0.3 6.5 V
VOVLO Maximum OVLO Pin Voltage Range OVLO –0.3 6.5 V
VdVdT Maximum dVdT Pin Voltage Range dVdt Internally Limited V
VITIMER Maximum ITIMER Pin Voltage Range ITIMER Internally Limited V
VPG Maximum PG Pin Voltage Range (TPS259460x) PG –0.3 6.5 V
VPGTH Maximum PGTH Pin Voltage Range (TPS259460x) PGTH –0.3 6.5 V
VSPLYGD Maximum SPLYGD Pin Voltage Range (TPS259461x) SPLYGD –0.3 6.5 V
VFLTB Maximum FLT Pin Voltage Range (TPS259461x) FLT –0.3 6.5 V
VILM Maximum ILM Pin Voltage Range ILM Internally Limited V
IMAX Maximum Continuous Switch Current IN - OUT Internally Limited A
TJ Junction temperature Internally Limited °C
TLEAD Maximum Lead Temperature 300 °C
TSTG Storage temperature –65 150 °C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.