ZHCSNR4B May   2021  – April 2022 TPS25946

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
      1.      15
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 8.3.2 Overvoltage Lockout (OVLO)
      3. 8.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 8.3.3.2 Active Current Limiting
        3. 8.3.3.3 Short-Circuit Protection
      4. 8.3.4 Analog Load Current Monitor
      5. 8.3.5 Reverse Current Protection
      6. 8.3.6 Overtemperature Protection (OTP)
      7. 8.3.7 Fault Response and Indication (FLT)
      8. 8.3.8 Power Good Indication (PG)
      9. 8.3.9 Input Supply Good Indication (SPLYGD)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Self-Controlled
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
        2. 9.2.2.2 Setting Overvoltage Threshold
        3. 9.2.2.3 Setting Output Voltage Rise Time (tR)
        4. 9.2.2.4 Setting Power Good Assertion Threshold
        5. 9.2.2.5 Setting Overcurrent Threshold (ILIM)
        6. 9.2.2.6 Setting Overcurrent Blanking Interval (tITIMER)
        7. 9.2.2.7 Selecting External Bias Resistor (R5)
        8. 9.2.2.8 Selecting External Diode (D1)
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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8.3.7 Fault Response and Indication (FLT)

The following table summarizes the device response to various fault conditions. Additionally, an active low external fault indication (FLT) pin is available on the TPS259461x variants.

Table 8-2 Fault Summary

Event

Protection Response

Fault Latched Internally

FLT Pin Status(1)

FLT Assertion Delay(1)

Overtemperature

Shutdown

Y

L

Undervoltage (UVP or UVLO)

Shutdown

N

H

Input Overvoltage

 Shutdown

N

H

Transient Overcurrent (ILIM < IOUT < 2 × ILIM)

None

N

H
Persistent Overcurrent

in Forward Direction (IN to OUT)

 Current Limit

N

L

tITIMER

OUT Pin Short-Circuit to GND

Circuit Breaker followed by Current Limit

N

H

ILM Pin Open

(During Steady State)

Shutdown

N

L

 tITIMER

ILM Pin Shorted to GND

Shutdown

Y

L

 tITIMER
(1) Applicable to TPS259461x variants only.

Faults which are latched internally can be cleared either by power cycling the part (pulling VIN to 0 V) or by pulling the EN/UVLO pin voltage below VSD. This also resets the tRST timer for the TPS25946xA (auto-retry) variants.

During a latched fault, pulling the EN/UVLO just below the UVLO threshold has no impact on the device. This is true for both TPS25946xL (latch-off) and TPS25946xA (auto-retry) variants.

The TPS25946xA (auto-retry) variants restart automatically on expiry of the tRST timer after a fault.