ZHCSSK0N june   2010  – july 2023 TPS2041B , TPS2042B , TPS2043B , TPS2044B , TPS2051B , TPS2052B , TPS2053B , TPS2054B

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 General Switch Catalog
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics (All Devices Excluding TPS2051BDBV and TPS2052BD)
    8. 7.8 Typical Characteristics (TPS2051BDBV and TPS2052BD)
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1  Power Switch
      2. 9.3.2  Charge Pump
      3. 9.3.3  Driver
      4. 9.3.4  Enable ( ENx)
      5. 9.3.5  Enable (ENx)
      6. 9.3.6  Current Sense
      7. 9.3.7  Overcurrent
        1. 9.3.7.1 Overcurrent Conditions (All Devices Excluding TPS2051BDBV, TPS2052BD)
        2. 9.3.7.2 Overcurrent Conditions (TPS2051BDBV, TPS2052BD)
      8. 9.3.8  Overcurrent ( OCx)
      9. 9.3.9  Thermal Sense
      10. 9.3.10 Undervoltage Lockout
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Universal Serial Bus (USB) Applications
    2. 10.2 Typical Application
      1. 10.2.1 Typical Application (TPS2042B)
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Power-Supply Considerations
          2. 10.2.1.2.2 OC Response
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Host and Self-Powered and Bus-Powered Hubs
        1. 10.2.2.1 Design Requirements
          1. 10.2.2.1.1 USB Power-Distribution Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Generic Hot-Plug Applications
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
        3. 10.2.3.3 Application Curves
  12. 11Power Supply Recommendations
    1. 11.1 Undervoltage Lockout (UVLO)
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Power Dissipation
    4. 12.4 Thermal Protection
  14. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 Related Links
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 静电放电警告
    6. 13.6 术语表
  15. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
VI(IN), VI(INx)Input voltage (2)–0.36V
VO(OUT), VO(OUTx)(2)Output voltage–0.36V
VI( EN), VI( ENx), VI(EN), VI(ENx)Input voltage–0.36V
VI(/OC), VI( OCx)Voltage range–0.36V
IO(OUT), IO(OUTx)Continuous output currentInternally limited
Continuous total power dissipationSee Dissipation Ratings
TJOperating virtual junction temperature–40125°C
TstgStorage temperature–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.