ZHCSKV6B March   2020  – February 2024 TPA6211T-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Operating Characteristics
    7. 5.7 Dissipation Ratings
    8.     Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Advantages of Fully Differential Amplifiers
      2. 6.3.2 Fully Differential Amplifier Efficiency and Thermal Information
      3. 6.3.3 Differential Output Versus Single-Ended Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Differential Input Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Resistors (RI)
          2. 7.2.1.2.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 7.2.1.2.3 Input Capacitor (CI)
          4. 7.2.1.2.4 Band-Pass Filter (RI, CI, and CF)
            1. 7.2.1.2.4.1 Step 1: Low-Pass Filter
            2. 7.2.1.2.4.2 Step 2: High-Pass Filter
            3. 7.2.1.2.4.3 Step 3: Additional Low-Pass Filter
          5. 7.2.1.2.5 Decoupling Capacitor (CS)
          6. 7.2.1.2.6 Using Low-ESR Capacitors
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Other Application Circuits
  9. 8 Power Supply Recommendations
    1. 8.1 Power Supply Decoupling Capacitor
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information

THERMAL METRIC(1)TPA6211T-Q1UNIT
DGN (HVSSOP)
8 PINS
RθJAJunction-to-ambient thermal resistance53.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance72.7°C/W
RθJBJunction-to-board thermal resistance26.4°C/W
ψJTJunction-to-top characterization parameter3.5°C/W
ψJBJunction-to-board characterization parameter26.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance10.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.