ZHCSSQ7 august   2023 TMUX7612

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 描述
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current Switch Pairs
    6. 6.6  Source or Drain Pulsed Current
    7. 6.7  Electrical Characteristics (12 V Single Supply)
    8. 6.8  Switching Characteristics (12 V Single Supply)
    9. 6.9  Electrical Characteristics (±15 V Dual Supply)
    10. 6.10 Switching Characteristics (±15 V Dual Supply)
    11. 6.11 Electrical Characteristics (±20 V Dual Supply)
    12. 6.12 Switching Characteristics (±20 V Dual Supply)
    13. 6.13 Electrical Characteristics (+37.5 V/–12.5 V Dual Supply)
    14. 6.14 Switching Characteristics (+37.5 V/–12.5 V Dual Supply)
    15. 6.15 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional Operation
      2. 7.3.2 Rail-to-Rail Operation
      3. 7.3.3 1.8 V Logic Compatible Inputs
      4. 7.3.4 Flat On-Resistance
      5. 7.3.5 Power-Up Sequence Free
      6. 7.3.6 Ultra-Low Charge Injection
      7. 7.3.7 Ultra-Low Leakage Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Truth Tables
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
      2. 8.2.2 Design Requirements
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.3 Thermal Information

THERMAL METRIC(1) TMUX7612 UNIT
RUM (QFN) PW (TSSOP)
16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance TBD TBD °C/W
RθJC(top) Junction-to-case (top) thermal resistance TBD TBD °C/W
RθJB Junction-to-board thermal resistance TBD TBD °C/W
ΨJT Junction-to-top characterization parameter TBD TBD °C/W
ΨJB Junction-to-board characterization parameter TBD TBD °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance TBD TBD °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.