ZHCSLO8D November   2020  – January 2022 TMUX6208 , TMUX6209

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Thermal Information
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Source or Drain Continuous Current
    6. 7.6  ±15 V Dual Supply: Electrical Characteristics 
    7. 7.7  ±15 V Dual Supply: Switching Characteristics 
    8. 7.8  36 V Single Supply: Electrical Characteristics 
    9. 7.9  36 V Single Supply: Switching Characteristics 
    10. 7.10 12 V Single Supply: Electrical Characteristics 
    11. 7.11 12 V Single Supply: Switching Characteristics 
    12. 7.12 ±5 V Dual Supply: Electrical Characteristics 
    13. 7.13 ±5 V Dual Supply: Switching Characteristics 
    14. 7.14 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  tON(EN) and tOFF(EN)
    6. 8.6  Break-Before-Make
    7. 8.7  tON (VDD) Time
    8. 8.8  Propagation Delay
    9. 8.9  Charge Injection
    10. 8.10 Off Isolation
    11. 8.11 Crosstalk
    12. 8.12 Bandwidth
    13. 8.13 THD + Noise
    14. 8.14 Power Supply Rejection Ratio (PSRR)
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 9.3.5 Fail-Safe Logic
      6. 9.3.6 Latch-Up Immune
      7. 9.3.7 Ultra-Low Charge Injection
    4. 9.4 Device Functional Modes
    5. 9.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

4 Revision History

Changes from Revision C (August 2021) to Revision D (January 2022)

  • Updated the Truth Tables sectionGo

Changes from Revision B (April 2021) to Revision C (August 2021)

  • 将 TMUX6208 和 TMUX6209 的 QFN 封装状态从预发布 更改为正在供货 Go
  • Added ESD detail for RUM packageGo
  • Added the Integrated Pull-Down Resistor on Logic Pins sectionGo
  • Updated the Ultra-Low Charge Injection sectionGo
  • Updated the TMUX620x Layout Example figures in the Layout Example sectionGo

Changes from Revision A (January 2021) to Revision B (April 2021)

  • Added thermal information for QFN packageGo
  • Added IDC specs for QFN package in Source or Drain Continuous Current table Go
  • Updated VDD rise time value from 100ns to 1µs in TON(VDD) test conditionGo
  • Updated CL value from 1nF to 100pF in Charge Injection test conditionGo

Changes from Revision * (November 2020) to Revision A (January 2021)

  • 将文档状态从预告信息 更改为量产数据 Go