ZHCSCU3C January   2014  – September 2019 TCA5013

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—Power Supply and ESD
    6. 6.6  Electrical Characteristics—Card VCC
    7. 6.7  Electrical Characteristics—Card RST
    8. 6.8  Electrical Characteristics—Card CLK
    9. 6.9  Electrical Characteristics—Card Interface IO, C4 and C8
    10. 6.10 Electrical Characteristics—PRES
    11. 6.11 Electrical Characteristics—IOMC1 and IOMC2
    12. 6.12 Electrical Characteristics—CLKIN1 and CLKIN2
    13. 6.13 Electrical Characteristics—A0 and SHDN
    14. 6.14 Electrical Characteristics—INT
    15. 6.15 Electrical Characteristics—GPIO
    16. 6.16 Electrical Characteristics—SDA and SCL
    17. 6.17 Electrical Characteristics—Fault Condition Detection
    18. 6.18 I2C Interface Timing Requirements
    19. 6.19 I2C Interface Timing Characteristics
    20. 6.20 Synchronous Type 1 Card Activation Timing Characteristics
    21. 6.21 Synchronous Type 2 Card Activation Timing Characteristics
    22. 6.22 Card Deactivation Timing Characteristics
    23. 6.23 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Card Interface Modules
      2. 8.3.2 SAM Card Interface Modules
      3. 8.3.3 User Card Interface Module
      4. 8.3.4 Clock Division and Multiplexing
      5. 8.3.5 IO Multiplexing
      6. 8.3.6 GPIO Operation
      7. 8.3.7 Power Management Features
      8. 8.3.8 ESD Protection
      9. 8.3.9 I2C interface
    4. 8.4 Device Functional Modes
      1. 8.4.1  Power Off Mode
      2. 8.4.2  Shutdown Mode
      3. 8.4.3  Standby Mode
      4. 8.4.4  Active Mode
        1. 8.4.4.1 User Card Operating Mode Selection
        2. 8.4.4.2 Synchronous Type 1 Operating Mode
        3. 8.4.4.3 Synchronous Type 2 Operating Mode
        4. 8.4.4.4 Manual Operating Mode
        5. 8.4.4.5 Asynchronous Operating Mode
        6. 8.4.4.6 Warm Reset Sequence
        7. 8.4.4.7 Deactivation Sequence
      5. 8.4.5  User Card Insertion / Removal Detection
      6. 8.4.6  IO Operation
        1. 8.4.6.1 IO Switching Control
        2. 8.4.6.2 IO Rise Time and Fall Time control
        3. 8.4.6.3 Current Limiting on IO Pin
      7. 8.4.7  CLK Operation
        1. 8.4.7.1 CLK Switching
        2. 8.4.7.2 CLK Rise Time and Fall Time Control
        3. 8.4.7.3 Current Limiting On CLK Pin
      8. 8.4.8  RST Operation
        1. 8.4.8.1 Current Limiting On RST
      9. 8.4.9  Interrupt Operation
        1. 8.4.9.1  Card Insertion And Removal
        2. 8.4.9.2  Over Current Fault
        3. 8.4.9.3  Supervisor Fault
        4. 8.4.9.4  Over Temperature Fault
        5. 8.4.9.5  EARLY Fault
        6. 8.4.9.6  MUTE Fault
        7. 8.4.9.7  Synchronous Activation Complete
        8. 8.4.9.8  VCC Ramp Fault
        9. 8.4.9.9  GPIO Input State Transition
        10. 8.4.9.10 POR Interrupt
      10. 8.4.10 Power Management
        1. 8.4.10.1 Voltage Supervisor
        2. 8.4.10.2 DC-DC Boost
        3. 8.4.10.3 LDOs and Load Transient Response
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Operation
        1. 8.5.1.1 I2C Read and Write Procedures
        2. 8.5.1.2 I2C Address Configuration
    6. 8.6 Register Maps
      1. 8.6.1 Memory Map
        1. Table 12. 91
        2. Table 13. 92
        3. Table 14. 93
        4. Table 15. 94
        5. Table 16. 95
        6. Table 17. 96
        7. Table 18. 97
        8. Table 19. 98
        9. Table 20. 99
        10. Table 21. 100
        11. Table 22. 101
        12. Table 23. 102
        13. Table 24. 103
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 IO Pin Fall Time Setting
        2. 9.2.2.2 CLK Pin Rise Time And Fall Time Settings
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On-Reset
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DC-DC Boost Layout Recommendation
      2. 11.1.2 Card Interface Layout Recommendations
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 商标
    2. 12.2 静电放电警告
    3. 12.3 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

TCA5013 is a smartcard interface IC that enables POS terminals to interface with EMV4.3 and ISO7816-3 and ISO7816-10 compliant smartcards. The device has 4 smartcard interfaces (1 user card and 3 SAM cards). TCA5013 is capable of card activation and deactivation per EMV4.3, ISO7816-3 and ISO7816-10 standards.

TCA5013 has two power supply pins - VDD and VDDI. VDD is the main power supply for the device and VDDI is the reference supply for the interface operating voltage. VDD and VDDI need to ramped to within the recommended operating conditions for the device to operate properly. Upon power up an internal Power-On-Reset circuit initializes the digital core with all the registers in their default state as described in Register Maps.

TCA5013 can operate in various functional modes as defined in Device Functional Modes. When one of the device power supplies is not applied, that is, VDD < VDDSH or VDDI < VDDITH the device is in Power Off Mode. None of the device functions are available in this mode. Shutdown Mode is the lowest power operating mode in the device. Shutdown mode is entered by asserting the SHDN = 0 when VDD > VDDSH and VDDI > VDDITH. The device can detect card insertion and removal even in Shutdown mode. The device is in Standby mode when VDD > VDDSH or VDDI > VDDITH and the SHDN pin = 1. When any of the 4 smartcard interfaces is activated, the device enters active mode (see Active Mode). The user card interface module can be activated in synchronous type 1, synchronous type 2, asynchronous or manual operation mode. For synchronous type 1 and synchronous type 2 operation modes, the device can automatically generate activation sequences per the ISO7816-10 standard (see Synchronous Type 1 Operating Mode and Synchronous Type 2 Operating Mode). For asynchronous cards the device performs the activation sequence and also verifies the response from the card meets the requirements per ISO7816-3 and EMV4.3 standards (see Asynchronous Operating Mode). The device also supports WARM reset ( see Warm Reset Sequence) and card deactivation (see Deactivation Sequence) of smartcards per the ISO7816-3 and EMV4.3 standards. The SAM card interface modules can only be activated in aynchronous operation mode.

All smartcard interfaces have the standard CLK, IO and RST pins (as defined by EMV4.3 and ISO7816 standards). All these pins are designed to have internal current limiting to prevent device damage when shorted. CLK and IO pins also provide automatic level translation to the voltage at which the card has been activated. Rrise time and fall time of the CLK and IO pins can also be controlled using digital register settings (see IO Rise Time and Fall Time control and CLK Rise Time and Fall Time Control). In addition to the CLK, IO and RST pins the user card interface also has PRES pin to detect card insertion and removal (see User Card Insertion / Removal Detection). C4 and C8 pins, as defined by ISO7816-10, are also present on the user card interface (see User Card Interface Module).

The device has internal boost and LDOs to generate the card activation voltage depending on the operating voltage required by the specific card being interfaced with. It also has a voltage supervisor that monitors VDD and VDDI and responds as described in Interrupt Operation . The power management section is described in more detail in Power Management.

In addition to these functions the device provides 8kV IEC 61000-4-2 ESD protection on all pins that interface to smartcards. This removes the need for any external ESD protection on the board, thereby providing system robustness without compromising system security (removable components on secure lines).

TCA5013 is configured using a standard I2C interface that is capable of up to 1 MHz operation. The I2C interface is also used to read the status of various fault conditions that the device can detect. The I2C operation is described in detail in I2C Interface Operation.