ZHCSMQ9B
September 2020 – November 2022
SN65MLVD203B
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
绝对最大额定值
6.2
ESD 等级
6.3
建议运行条件
6.4
热性能信息
6.5
电气特性
6.6
电气特性 - 驱动器
6.7
电气特性 - 接收器
6.8
开关特性 - 驱动器
6.9
开关特性 - 接收器
6.10
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagrams
8.3
Feature Description
8.3.1
Power-On-Reset
8.3.2
ESD Protection
8.3.3
RX Maximum Jitter While DE Toggling
8.4
Device Functional Modes
8.4.1
Operation with VCC < 1.5 V
8.4.2
Operations with 1.5 V ≤ VCC < 3 V
8.4.3
Operation with 3 V ≤ VCC < 3.6 V
8.4.4
Device Function Tables
8.4.5
Equivalent Input and Output Schematic Diagrams
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Multipoint Communications
9.2.2
Design Requirements
9.2.3
Detailed Design Procedure
9.2.3.1
Supply Voltage
9.2.3.2
Supply Bypass Capacitance
9.2.3.3
Driver Input Voltage
9.2.3.4
Driver Output Voltage
9.2.3.5
Termination Resistors
9.2.3.6
Receiver Input Signal
9.2.3.7
Receiver Input Threshold (Failsafe)
9.2.3.8
Receiver Output Signal
9.2.3.9
Interconnecting Media
9.2.3.10
PCB Transmission Lines
9.2.4
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Microstrip vs. Stripline Topologies
9.4.1.2
Dielectric Type and Board Construction
9.4.1.3
Recommended Stack Layout
9.4.1.4
Separation Between Traces
9.4.1.5
Crosstalk and Ground Bounce Minimization
9.4.1.6
Decoupling
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
接收文档更新通知
10.3
支持资源
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
术语表
11
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RUM|16
MPQF223A
散热焊盘机械数据 (封装 | 引脚)
RUM|16
QFND157C
订购信息
zhcsmq9b_oa
zhcsmq9b_pm
8.4.5
Equivalent Input and Output Schematic Diagrams