For best operational performance of the device, use good printed-circuit board (PCB) layout practices, including:

• Reduce parasitic coupling by running input traces as far away from supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better as opposed to in parallel with the noisy trace.
• Place the external components as close to the device as possible.
• Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit. For differential circuits, match the length of the input traces as best possible.
• Keep high impedance input signals away from noisy traces.
• Make sure system supply voltages are adequately filtered.
• Clean the PCB following board assembly for best performance.
• Any precision integrated circuit can experience performance shifts resulting from moisture ingress into the plastic package. Following any aqueous PCB cleaning process, bake the PCB assembly to remove moisture introduced into the device packaging during the cleaning process. A low temperature, post-cleaning bake at 85°C for 30 minutes is sufficient for most circumstances.
• Only connect one of the two GND/SUB pins to the ground plane, to prevent the formation of current return paths through the device substrate. Float the other GND/SUB pin.