ZHCSOX1
October 2020
OPA455
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Status Flag Pin
7.3.2
Thermal Protection
7.3.3
Current Limit
7.3.4
Enable and Disable
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
High DAC Gain Stage for Semiconductor Test Equipment
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
Improved Howland Current Pump for Bioimpedance Measurements in Multiparameter Patient Monitors
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Thermally-Enhanced PowerPAD™ Package
10.1.2
PowerPAD™ Integrated Circuit Package Layout Guidelines
10.1.3
Pin Leakage
10.1.4
Thermal Protection
10.1.5
Power Dissipation
10.1.6
Heat Dissipation
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.1.1.1
TINA-TI™ Simulation Software (Free Download)
11.1.1.2
TI Precision Designs
11.1.1.3
WEBENCH® Filter Designer
11.2
Documentation Support
11.2.1
Related Documentation
11.3
支持资源
11.4
Trademarks
11.5
静电放电警告
11.6
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DDA|8
MPDS092F
散热焊盘机械数据 (封装 | 引脚)
DDA|8
PPTD043J
订购信息
zhcsox1_oa
zhcsox1_pm
11.5
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。