ZHCSJY2A June   2019  – September 2019 OPA2834

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      1kHz FFT 图(VOUT = 1VRMS,RL = 100kΩ,G = 1)
      2.      低侧电流分流监控
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: 3V to 5V
    6. 7.6 Typical Characteristics: Vs = 5 V
    7. 7.7 Typical Characteristics: VS = 3.0 V
    8. 7.8 Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      4. 8.3.4 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 8.4.2 Single-Supply Operation (2.7 V to 5.4 V)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Noninverting Amplifier
      2. 9.1.2 Inverting Amplifier
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Field Transmitter Sensor Interface
      3. 9.2.3 Ultrasonic Flow Meters
      4. 9.2.4 Microphone Pre-Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The OPA2837EVM can be used as a reference when designing the circuit board. TI recommends following the EVM layout of the external components near to the amplifier, ground plane construction, and power routing as closely as possible. Follow these general guidelines:

  1. Signal routing must be direct and as short as possible into and out of the op amp.
  2. The feedback path must be short and direct avoiding vias if possible, especially with G = 1 V/V.
  3. Ground or power planes must be removed from directly under the negative input and output pins of the amplifier.
  4. TI recommends placing a series output resistor as close to the output pin as possible.
  5. See Figure 40 for recommended values for the expected capacitive load. These values are derived targeting a 30° phase margin to the output of the op amp.
  6. A 2.2-µF power-supply decoupling capacitor must be placed within two inches of the device and can be shared with other op amps. For split supply, a capacitor is required for both supplies.
  7. A 0.1-µF power-supply decoupling capacitor must be placed as close to the supply pins as possible, preferably within 0.1 inch. For split supply, a capacitor is required for both supplies.