ZHCSD40N April   2012  – April 2018 LP5907

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions: DSBGA
    2.     Pin Functions: X2SON, SOT-23
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Output and Input Capacitors
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Low Output Noise
      3. 7.3.3 Output Automatic Discharge
      4. 7.3.4 Remote Output Capacitor Placement
      5. 7.3.5 Thermal Overload Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable (EN)
      2. 7.4.2 Minimum Operating Input Voltage (VIN)
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Power Dissipation and Device Operation
        3. 8.2.2.3 External Capacitors
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Capacitor Characteristics
        7. 8.2.2.7 Remote Capacitor Operation
        8. 8.2.2.8 No-Load Stability
        9. 8.2.2.9 Enable Control
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 X2SON Mounting
      2. 10.1.2 DSBGA Mounting
      3. 10.1.3 DSBGA Light Sensitivity
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 使用 WEBENCH® 工具创建定制设计
      2. 11.1.2 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The dynamic performance of the LP5907 is dependant on the layout of the PCB. PCB layout practices that are adequate for typical LDOs may degrade the PSRR, noise, or transient performance of the LP5907.

Best performance is achieved by placing CIN and COUT on the same side of the PCB as the LP5907, and as close to the package as is practical. The ground connections for CIN and COUT must be back to the LP5907 ground pin using as wide and short a copper trace as is practical.

Connections using long trace lengths, narrow trace widths, and/or connections through vias must be avoided. These add parasitic inductances and resistance that results in inferior performance especially during transient conditions