ZHCSQG8 October   2023 LP5811

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  9. 8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Synchronous Boost Converter
        1. 9.3.1.1 Undervoltage Lockout
        2. 9.3.1.2 Enable and Soft Start
        3. 9.3.1.3 Switching Frequency
        4. 9.3.1.4 Current Limit Operation
        5. 9.3.1.5 Boost PWM Mode
        6. 9.3.1.6 Boost PFM Mode
      2. 9.3.2 Analog Dimming
      3. 9.3.3 PWM Dimming
      4. 9.3.4 Autonomous Animation Engine Control
        1. 9.3.4.1 Animation Engine Pattern
        2. 9.3.4.2 Sloper
        3. 9.3.4.3 Animation Engine Unit (AEU)
        4. 9.3.4.4 Animation Pause Unit (APU)
      5. 9.3.5 Protections and Diagnostics
        1. 9.3.5.1 Overvoltage Protection
        2. 9.3.5.2 Output Short-to-Ground Protection
        3. 9.3.5.3 LED Open Detections
        4. 9.3.5.4 LED Short Detections
        5. 9.3.5.5 Thermal Shutdown
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
    6. 9.6 Register Maps
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Inductor Selection
        2. 10.2.3.2 Output Capacitor Selection
        3. 10.2.3.3 Input Capacitor Selection
        4. 10.2.3.4 Program Procedure
        5. 10.2.3.5 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.2.3.3 Input Capacitor Selection

Multilayer X5R or X7R ceramic capacitors are excellent choices for the input decoupling of the integrated boost converter, because of the extremely low ESR and small footprint. Input capacitors must be located as close as possible to the device. While a 10-μF input capacitor is sufficient for most applications, large capacitance is used to reduce input current ripple. When the input power is supplied through long wire and only ceramic capacitor is put, the load step at the output induces ringing at the VIN pin. This ringing couples back to the output and influence loop stability or even damage the device. In this circumstance, placing additional bulk capacitance (tantalum or aluminum electrolytic capacitor) between ceramic input capacitor and the power supply can reduce the ringing