ZHCSTV0L
November 2001 – February 2025
LP2992
PRODUCTION DATA
1
1
特性
2
应用
3
说明
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.3.1
Current Limit (Legacy Chip)
6.3.3.2
Current Limit (New Chip)
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Output Pulldown
6.3.6
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Normal Operation
6.4.2
Dropout Operation
6.4.3
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Estimating Junction Temperature
7.1.2
Input and Output Capacitor Requirements
7.1.3
Noise Bypass Capacitor (CBYPASS)
7.1.4
Power Dissipation (PD)
7.1.5
Recommended Capacitor Types
7.1.5.1
Recommended Capacitors (Legacy Chip)
7.1.5.1.1
Tantalum Capacitors (Legacy Chip)
7.1.5.2
Recommended Capacitors (New Chip)
7.1.6
Reverse Current
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
ON/OFF Operation
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Examples
8
Device and Documentation Support
8.1
Device Nomenclature
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
支持资源
8.5
Trademarks
8.6
静电放电警告
8.7
术语表
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
NGD|6
MPDS393
DBV|5
MPDS018T
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcstv0l_oa
zhcstv0l_pm
8.6
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。