ZHCSS00AB March   2000  – June 2025 LP2985-N

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Output Pulldown
      6. 6.3.6 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
        1. 7.1.1.1 Recommended Capacitors (Legacy Chip)
        2. 7.1.1.2 Recommended Capacitors (New Chip)
      2. 7.1.2 Input Capacitor Requirements
      3. 7.1.3 Output Capacitor Requirements
      4. 7.1.4 Noise Bypass Capacitor (CBYPASS)
      5. 7.1.5 Reverse Current
      6. 7.1.6 Power Dissipation (PD)
      7. 7.1.7 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 ON/OFF Input Operation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 器件和文档支持
    1. 8.1 文档支持
      1. 8.1.1 相关文档
    2. 8.2 器件命名规则
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 商标
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 1.0V or 2.5V (whichever is greater), IOUT = 1mA, ON/OFF pin tied to VIN, CIN = 1.0µF, and COUT = 4.7µF (unless otherwise noted)
LP2985-N VOUT vs Temperature (Legacy Chip)
 
Figure 5-1 VOUT vs Temperature (Legacy Chip)
LP2985-N Short-Circuit Current vs Output Voltage (Legacy Chip)
 
Figure 5-3 Short-Circuit Current vs Output Voltage (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-5 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-7 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs
                        Frequency (New Chip)
VIN = 5V, VOUT = 3.3V, COUT = 10μF, CBYP = 0nF
Figure 5-9 Ripple Rejection vs Frequency (New Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-11 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-13 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-15 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Output Impedance vs Frequency (Legacy Chip)
 
Figure 5-17 Output Impedance vs Frequency (Legacy Chip)
LP2985-N Output Noise Density (Legacy Chip)
 
Figure 5-19 Output Noise Density (Legacy Chip)
LP2985-N Output Noise Density (Legacy Chip)
 
Figure 5-21 Output Noise Density (Legacy Chip)
LP2985-N Ground Pin vs Load Current (Legacy Chip)
 
Figure 5-23 Ground Pin vs Load Current (Legacy Chip)
LP2985-N Dropout Voltage vs Temperature (Legacy Chip)
 
Figure 5-25 Dropout Voltage vs Temperature (Legacy Chip)
LP2985-N Input
                        Current vs VIN (Legacy Chip)
 
Figure 5-27 Input Current vs VIN (Legacy Chip)
LP2985-N GND
                        Pin Current vs Temperature (Legacy Chip)
 
Figure 5-29 GND Pin Current vs Temperature (Legacy Chip)
LP2985-N Instantaneous Short-Circuit Current (Legacy Chip)
 
Figure 5-31 Instantaneous Short-Circuit Current (Legacy Chip)
LP2985-N VOUT vs Temperature (New Chip)
VIN = 4.3V, VOUT = 3.3V
Figure 5-2 VOUT vs Temperature (New Chip)
LP2985-N Short-Circuit Current vs
                        Output Voltage (New Chip)
 
Figure 5-4 Short-Circuit Current vs Output Voltage (New Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-6 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-8 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-10 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs Frequency (Legacy Chip)
 
Figure 5-12 Ripple Rejection vs Frequency (Legacy Chip)
LP2985-N Ripple Rejection vs
                        Frequency (New Chip)
VIN = 3.7V, VOUT = 3.3V, COUT = 10μF, CBYP = 0nF
Figure 5-14 Ripple Rejection vs Frequency (New Chip)
LP2985-N Ripple Rejection vs
                        Frequency (New Chip)
 
Figure 5-16 Ripple Rejection vs Frequency (New Chip)
LP2985-N Output Impedance vs Frequency (Legacy Chip)
 
Figure 5-18 Output Impedance vs Frequency (Legacy Chip)
LP2985-N Output Noise Density vs
                        Frequency (New Chip)
 
Figure 5-20 Output Noise Density vs Frequency (New Chip)
LP2985-N Output Noise Density vs
                        Frequency (New Chip)
 
Figure 5-22 Output Noise Density vs Frequency (New Chip)
LP2985-N Ground Pin Current vs Load
                        Current (New Chip)
 
Figure 5-24 Ground Pin Current vs Load Current (New Chip)
LP2985-N Dropout Voltage vs
                        Temperature (New Chip)
 
Figure 5-26 Dropout Voltage vs Temperature (New Chip)
LP2985-N Input Current vs
                            VIN (New Chip)
 
Figure 5-28 Input Current vs VIN (New Chip)
LP2985-N GND
                        Pin Current vs Temperature (New Chip)
 
Figure 5-30 GND Pin Current vs Temperature (New Chip)
LP2985-N Short-Circuit Current vs
                        Temperature (New Chip)
 
Figure 5-32 Short-Circuit Current vs Temperature (New Chip)