ZHCSHV4G
October 2017 – December 2020
LM74700-Q1
PRODMIX
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
7
Typical Characteristics
8
Parameter Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Input Voltage
9.3.2
Charge Pump
9.3.3
Gate Driver
9.3.4
Enable
9.4
Device Functional Modes
9.4.1
Shutdown Mode
9.4.2
Conduction Mode
9.4.2.1
Regulated Conduction Mode
9.4.2.2
Full Conduction Mode
9.4.2.3
Reverse Current Protection Mode
10
Application and Implementation
10.1
Application Information
10.1.1
Typical Application
10.1.1.1
Design Requirements
10.1.1.2
Detailed Design Procedure
10.1.1.2.1
Design Considerations
10.1.1.2.2
MOSFET Selection
10.1.1.2.3
Charge Pump VCAP, input and output capacitance
10.1.1.3
Selection of TVS Diodes for 12-V Battery Protection Applications
10.1.1.4
Selection of TVS Diodes and MOSFET for 24-V Battery Protection Applications
10.1.1.5
Application Curves
10.2
OR-ing Application Configuration
11
Power Supply Recommendations
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
Device and Documentation Support
13.1
接收文档更新通知
13.2
支持资源
13.3
Trademarks
13.4
静电放电警告
13.5
术语表
14
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
DDF|8
MPDS569B
DBV|6
MPDS026O
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcshv4g_oa
zhcshv4g_pm
13.4
静电放电警告
静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。