ZHCSOA2A 数据表 | 德州仪器 TI.com.cn

ZHCSOA2A July 2020 – July 2021 LM63610-Q1

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

PWP|16
- MPDS371A
DRR|12
- MPSS085A

散热焊盘机械数据 (封装 | 引脚)

PWP|16
- PPTD262C
DRR|12
- PPTD366A

订购信息

7.1 Absolute Maximum Ratings

Over the recommended junction temperature range⁽¹⁾

PARAMETER		MIN	MAX	UNIT
	VIN to PGND (HTSSOP package)	–0.3	40	V
	VIN to PGND (WSON package)	–0.3	42	V
	EN to AGND (HTSSOP package)	–0.3	40	V
	EN to AGND (WSON package)	–0.3	42	V
	SYNC/MODE to AGND	–0.3	6	V
	VOUT_SEL and RT to AGND	–0.3	5.5	V
	RESET to AGND	–0.3	16	V
	FB to AGND (Fixed VOUT mode)	–0.3	16	V
	FB to AGND (Adjustable VOUT mode)	–0.3	5.5	V
	AGND to PGND	–0.3	0.3	V
	SW to PGND for transients of less than 10ns (HTSSOP package)	-6	40	V
	SW to PGND for transients of less than 10ns (WSON package)	-6	42	V
	BOOT to SW	–0.3	5.5	V
	VCC to AGND	–0.3	5.5	V
T_J	Junction temperature	–40	150	°C
T_stg	Storage temperature	–65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.