ZHCSSZ8D may   2004  – august 2023 LM386

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 LM386 with Gain = 20
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Gain Control
          2. 9.2.1.2.2 Input Biasing
        3. 9.2.1.3 Application Curve
      2. 9.2.2 LM386 with Gain = 200
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 LM386 with Gain = 50
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
      4. 9.2.4 Low Distortion Power Wienbridge Oscillator
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curve
      5. 9.2.5 LM386 with Bass Boost
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
        3. 9.2.5.3 Application Curve
      6. 9.2.6 Square Wave Oscillator
        1. 9.2.6.1 Detailed Design Procedure
        2. 9.2.6.2 Application Curve
      7. 9.2.7 AM Radio Power Amplifier
        1. 9.2.7.1 Design Requirements
        2. 9.2.7.2 Detailed Design Procedure
        3. 9.2.7.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
  14.   Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
  • DGK|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

特性

  • 电池供电
  • 外部元件超少
  • 宽电源电压范围:4V 至 12V 或
    5V 至 18V
  • 低静态电流消耗:4mA
  • 电压增益范围:20 至 200
  • 以地为基准的输入
  • 自动居中的输出静态电压
  • 低失真:0.2%(AV = 20,VS = 6V,RL = 8Ω,PO = 125mW,f = 1kHz)
  • 采用 8 引脚 MSOP 封装