ZHCSH33Z September   1997  – April 2025 LM317

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (Legacy Chip)
    5. 6.5 Thermal Information (New Chip)
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 NPN Darlington Output Drive
      2. 7.3.2 Overload Block
      3. 7.3.3 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation In Self Protection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1  0V to 30V Regulator Circuit
      2. 8.3.2  Adjustable Regulator Circuit With Improved Ripple Rejection
      3. 8.3.3  Precision Current-Limiter Circuit
      4. 8.3.4  Tracking Preregulator Circuit
      5. 8.3.5  1.25V to 20V Regulator Circuit With Minimum Program Current
      6. 8.3.6  Battery-Charger Circuit
      7. 8.3.7  50mA, Constant-Current, Battery-Charger Circuit
      8. 8.3.8  Slow Turn-On 15V Regulator Circuit
      9. 8.3.9  AC Voltage-Regulator Circuit
      10. 8.3.10 Current-Limited 6V Charger Circuit
      11. 8.3.11 Adjustable 4A Regulator Circuit
      12. 8.3.12 High-Current Adjustable Regulator Circuit
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Considerations
          1. 8.5.1.1.1 Heat Sink Requirements
          2. 8.5.1.1.2 Heat Sinking Surface-Mount Packages
            1. 8.5.1.1.2.1 Heatsinking the SOT-223 (DCY) Package
            2. 8.5.1.1.2.2 Heat Sinking the TO-263 (KTT) Package
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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9.5 静电放电警告

LM317 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。