ZHCSH33Z September   1997  – April 2025 LM317

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information (Legacy Chip)
    5. 6.5 Thermal Information (New Chip)
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 NPN Darlington Output Drive
      2. 7.3.2 Overload Block
      3. 7.3.3 Programmable Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Operation With Low Input Voltage
      3. 7.4.3 Operation at Light Loads
      4. 7.4.4 Operation In Self Protection
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1  0V to 30V Regulator Circuit
      2. 8.3.2  Adjustable Regulator Circuit With Improved Ripple Rejection
      3. 8.3.3  Precision Current-Limiter Circuit
      4. 8.3.4  Tracking Preregulator Circuit
      5. 8.3.5  1.25V to 20V Regulator Circuit With Minimum Program Current
      6. 8.3.6  Battery-Charger Circuit
      7. 8.3.7  50mA, Constant-Current, Battery-Charger Circuit
      8. 8.3.8  Slow Turn-On 15V Regulator Circuit
      9. 8.3.9  AC Voltage-Regulator Circuit
      10. 8.3.10 Current-Limited 6V Charger Circuit
      11. 8.3.11 Adjustable 4A Regulator Circuit
      12. 8.3.12 High-Current Adjustable Regulator Circuit
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Considerations
          1. 8.5.1.1.1 Heat Sink Requirements
          2. 8.5.1.1.2 Heat Sinking Surface-Mount Packages
            1. 8.5.1.1.2.1 Heatsinking the SOT-223 (DCY) Package
            2. 8.5.1.1.2.2 Heat Sinking the TO-263 (KTT) Package
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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10 Revision History

Changes from Revision Y (April 2020) to Revision Z (April 2025)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 向文档添加了新的硅器件Go
  • 向典型特性 部分添加了新器件图表Go
  • 更改了特性、应用 和说明 部分Go
  • Added LM317 (New Chip) column to Device Comparison Table Go
  • Changed DCY pinout drawing and INPUT and OUTPUT description in Pin Functions tableGo
  • Added Power dissipation row to Absolute Maximum Ratings tableGo
  • Added new chip information to ESD Ratings tableGo
  • Added Thermal Information (New Chip) tableGo
  • Changed Electrical Characteristics tableGo
  • Changed ADJUST pin current discussion in second paragraph of Overview sectionGo
  • Added effect of CADJ on ripple rejection discussion to second bullet of Design Requirements Go
  • Added new silicon curves to Application Curves Go
  • Deleted −10V from Equation 2Go
  • Changed The NPNs to The PNP (2N2905) and NPN (2N6486) in High-Current Adjustable Regulator Circuit sectionGo
  • Added Thermal Considerations section and subsectionsGo

Changes from Revision X (September 2016) to Revision Y (April 2020)

  • Added Device Comparison Table Go
  • Changed VIN to IOUT in Load Transient Response figuresGo
  • Added missing caption to second y-axis in second Load Transient Response figureGo
  • Changed VOUT and output impedance equations in Battery-Charger Circuit sectionGo