ZHCS529I January   2007  – April 2025 LM25574

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 High Voltage Start-Up Regulator
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown and Standby Mode
      2. 6.4.2 Oscillator and Sync Capability
      3. 6.4.3 Error Amplifier and PWM Comparator
      4. 6.4.4 Ramp Generator
      5. 6.4.5 Maximum Duty Cycle and Input Drop-out Voltage
      6. 6.4.6 Current Limit
      7. 6.4.7 Soft-Start
      8. 6.4.8 Boost Pin
      9. 6.4.9 Thermal Protection
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Schematic for High Frequency (1MHz) Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1  Custom Design With WEBENCH® Tools
        2. 7.2.3.2  External Components
        3. 7.2.3.3  R3 -RT Resistor
        4. 7.2.3.4  L1-Inductor
        5. 7.2.3.5  C3 (CRAMP)
        6. 7.2.3.6  C9-Output Capacitor
        7. 7.2.3.7  C1-Input Capacitor
        8. 7.2.3.8  C8- VCC Capacitor
        9. 7.2.3.9  C7- BST capacitor
        10. 7.2.3.10 C4 - SS Capacitor
        11. 7.2.3.11 R5, R6 - Feedback Resistor
        12. 7.2.3.12 R1, R2, C2 - SD Pin Components
        13. 7.2.3.13 R4, C5, C6 - Compensation Components
        14. 7.2.3.14 Bias Power Dissipation Reduction
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Thermal Considerations
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Developmental Support
        1. 8.1.1.1 Custom Design With WEBENCH® Tools
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Boost Pin

The LM25574 integrates an N-Channel buck switch and associated floating high voltage level shift / gate driver. This gate driver circuit works in conjunction with an internal diode and an external bootstrap capacitor. TI recommends a 0.022 µF ceramic capacitor connected with short traces between the BST pin and SW pin. During the off-time of the buck switch, the SW pin voltage is approximately –0.5 V and the bootstrap capacitor is charged from Vcc through the internal bootstrap diode. When operating with a high PWM duty cycle, the buck switch is forced off each cycle for 500ns to make sure that the bootstrap capacitor is recharged.

Under very light load conditions or when the output voltage is pre-charged, the SW voltage does not remain low during the off-time of the buck switch. If the inductor current falls to zero and the SW pin rises, the bootstrap capacitor does not receive sufficient voltage to operate the buck switch gate driver. For these applications, the PRE pin can be connected to the SW pin to pre-charge the bootstrap capacitor. The internal pre-charge MOSFET and diode connected between the PRE pin and PGND turns on each cycle for 250ns just prior to the onset of a new switching cycle. If the SW pin is at a normal negative voltage level (continuous conduction mode), then no current flows through the pre-charge MOSFET/diode.