DO+/RI+ |
14, 16, 19, 21 |
I/O |
True Bus LVDS Driver Outputs and Receiver Inputs. |
DO−/RI− |
13, 15, 18, 20 |
I/O |
Complimentary Bus LVDS Driver Outputs and Receiver Inputs. |
DIN |
35, 37, 40, 42 |
I |
LVTTL Driver Input. No pull up or pull down is attached to this pin |
RO |
36, 38, 41, 43 |
O |
LVTTL Receiver Output. |
RE12 |
29 |
I |
Receiver Enable LVTTL Input (Active Low). This pin, when low, configures receiver outputs, RO1 and RO2 active. When this pin is high, RO1 and RO2 are TRI-STATE. If this pin is floating, a weak current source to VCC causes RO1 and RO2 to be TRI-STATE |
RE34 |
5 |
I |
Receiver Enable LVTTL Input (Active Low). This pin, when low, configures receiver outputs, RO3 and RO4 active. When this pin is high, RO3 and RO4 are TRI-STATE. If this pin is floating, a weak current source to VCC causes RO3 and RO4 to be TRI-STATE |
DE12 |
26 |
I |
Driver Enable LVTTL Input (Active High). This pin, when high, configures driver outputs, DO1+/RIN1+, DO1−/RIN1− and DO2+/RIN2+, DO2−/RIN2− active. When this pin is low, driver outputs 1 and 2 are TRI-STATE. If this pin is floating, a weak current source to VCC causes driver outputs 1 and 2 to be active |
DE34 |
8 |
I |
Driver Enable LVTTL Input (Active High). This pin, when high, configures driver outputs, DO3+/RIN3+, DO3−/RIN3− and DO4+/RIN4+, DO4−/RIN4− active. When this pin is low, driver outputs 3 and 4 are TRI-STATE. If this pin is floating, a weak current source to VCC causes driver outputs 3 and 4 to be active |
GND |
4, 28, 31, 39 |
Ground |
Ground for digital circuitry (must connect to GND on PC board). These pins connected internally. |
VCC |
3, 6, 30 |
Power |
VCC for digital circuitry (must connect to VCC on PC board). These pins connected internally. |
AGND |
9, 17, 25 |
Ground |
Ground for analog circuitry (must connect to GND on PC board). These pins connected internally. |
AVCC |
7, 10, 22, 27 |
Power |
Analog VCC (must connect to VCC on PC board). These pins connected internally. |
NC |
1, 2, 11, 12, 23, 24, 32, 33, 34, 44 |
N/A |
Reserved for future use, leave open circuit. |
DAP |
| GND |
Must connect to GND plane through vias to achieve the theta ja specified under Absolute Maximum Ratings. The DAP (die attach pad) is the heat transfer material that is centered on the bottom of the WQFN package. Refer to application note AN-1187 () for attachment details. |