ZHCSFB0D June   2016  – November 2023 DRV2510-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input and Configurable Pre-amplifier
      2. 7.3.2 Pulse-Width Modulator (PWM)
      3. 7.3.3 Designed for low EMI
      4. 7.3.4 Device Protection Systems
        1. 7.3.4.1 Diagnostics
          1. 7.3.4.1.1 Load Diagnostics
        2. 7.3.4.2 Faults During Load Diagnostics
        3. 7.3.4.3 Protection and Monitoring
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation in Shutdown Mode
      2. 7.4.2 Operation in Standby Mode
      3. 7.4.3 Operation in Active Mode
    5. 7.5 Programming
      1. 7.5.1 General I2C Operation
      2. 7.5.2 Single-Byte and Multiple-Byte Transfers
      3. 7.5.3 Single-Byte Write
      4. 7.5.4 Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 7.5.5 Single-Byte Read
      6. 7.5.6 Multiple-Byte Read
    6. 7.6 Register Map
      1. 7.6.1 Address: 0x01
      2. 7.6.2 Address: 0x02
      3. 7.6.3 Address: 0x03
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Single-Ended Source
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Optional Components
          2. 8.2.1.2.2 Capacitor Selection
          3. 8.2.1.2.3 Solenoid Selection
          4. 8.2.1.2.4 Output Filter Considerations
        3. 8.2.1.3 Application Curves
        4. 8.2.1.4 Differential Input Diagram
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6.2 Address: 0x02

Figure 7-10 0x02
76543210
DEV_ACTIVE
[0]		STDBY
[0]		DIAG_ACTIVE
[0]		FAULT
[0]		LOAD_SHORT
[0]		LOAD_OPEN
[0]		LOAD_SHORT_GND
[0]		LOAD_SHORT_VDD
[0]
RO-0RO-0RO-0RO-0RO-0RO-0RO-0RO-0
Table 7-5 Address: 0x02
BIT FIELD TYPE DEFAULT DESCRIPTION
7 DEV_ACTIVE RO 0 Shows the device status (active or shutdown).
0 Device is shutdown.
1 Device is active.
6 STDBY RO 0 Shows the device standby status.
0 Device is not on standby.
1 Device is on standby.
5 DIAG_ACTIVE RO 0 Shows the status of the diagnositcs engine.
0 Not performing load diagnostics.
1 Performing load diagnostics.
4 FAULT RO 0 Shows if a fault has occurred on the system. Either over-voltage, under-voltage, over-current, over-temperature.
0 No fault has occurred.
1 A fault has occurred.
3 LOAD_SHORT RO 0 Shows whether the output is shorted.
0 OUT+ is not shorted to OUT-.
1 OUT+ is shorted to OUT-.
2 LOAD_OPEN RO 0 Shows whether the output has a proper load connected.
0 A proper load is connected between OUT+ and OUT-.
1 There is an open connection between OUT+ and OUT-.
1 LOAD_SHORT_GND RO 0 Shows whether the output is shorted to GND.
0 Output is not shorted to GND.
1 Either OUT+ or OUT- is shorted to GND.
0 LOAD_SHORT_VDD RO 0 Shows whether the output is shorted to VDD.
0 Output is not shorted to VDD.
1 Either OUT+ or OUT- is shorted to VDD.