ZHCSAV5F April   2013  – May 2019 DLPC350

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化应用
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. Table 1. Power and Ground Pin Descriptions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  I/O Electrical Characteristics
    6. 6.6  I2C0 and I2C1 Interface Timing Requirements
    7. 6.7  Port 1 Input Pixel Interface Timing Requirements
    8. 6.8  Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing Requirements
    9. 6.9  System Oscillator Timing Requirements
    10. 6.10 Reset Timing Requirements
    11. 6.11 Video Timing Input Blanking Specification
      1. 6.11.1 Source Input Blanking
    12. 6.12 Programmable Output Clocks Switching Characteristics
    13. 6.13 DMD Interface Switching Characteristics
    14. 6.14 JTAG Interface: I/O Boundary Scan Application Switching Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Power Consumption
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Board Level Test Support
    4. 8.4 Device Functional Modes
      1. 8.4.1 Structured Light Applications
      2. 8.4.2 (LVDS) Receiver Supported Pixel Mapping Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Chipset Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 DLPC350 System Interfaces
            1. 9.2.1.2.1.1 Control Interface
            2. 9.2.1.2.1.2 Input Data Interface
          2. 9.2.1.2.2 DLPC350 System Output Interfaces
            1. 9.2.1.2.2.1 Illumination Interface
            2. 9.2.1.2.2.2 Trigger Interface (Sync Outputs)
          3. 9.2.1.2.3 DLPC350 System Support Interfaces
            1. 9.2.1.2.3.1 Reference Clock
            2. 9.2.1.2.3.2 PLL
            3. 9.2.1.2.3.3 Program Memory Flash Interface
          4. 9.2.1.2.4 DMD Interfaces
            1. 9.2.1.2.4.1 DLPC350 to DMD Digital Data
            2. 9.2.1.2.4.2 DLPC350 to DMD Control Interface
            3. 9.2.1.2.4.3 DLPC350 to DMD Micromirror Reset Control Interface
  10. 10Power Supply Recommendations
    1. 10.1 System Power and Reset
      1. 10.1.1 Default Conditions
        1. 10.1.1.1 1.2-V System Power
        2. 10.1.1.2 1.8-V System Power
        3. 10.1.1.3 1.9-V System Power
        4. 10.1.1.4 3.3-V System Power
        5. 10.1.1.5 FPD-Link Input LVDS System Power
      2. 10.1.2 System Power-up and Power-down Sequence
      3. 10.1.3 Power-On Sense (POSENSE) Support
      4. 10.1.4 Power-Good (PWRGOOD) Support
      5. 10.1.5 5-V Tolerant Support
      6. 10.1.6 Power Reset Operation
      7. 10.1.7 System Reset Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 DMD Interface Design Considerations
      2. 11.1.2 DMD Termination Requirements
      3. 11.1.3 Decoupling Capacitors
      4. 11.1.4 Power Plane Recommendations
      5. 11.1.5 Signal Layer Recommendations
      6. 11.1.6 General Handling Guidelines for CMOS-Type Pins
      7. 11.1.7 PCB Manufacturing
        1. 11.1.7.1 General Guidelines
        2. 11.1.7.2 Trace Widths and Minimum Spacings
        3. 11.1.7.3 Routing Constraints
        4. 11.1.7.4 Fiducials
        5. 11.1.7.5 Flex Considerations
        6. 11.1.7.6 DLPC350 Thermal Considerations
    2. 11.2 Layout Example
      1. 11.2.1 Printed Circuit Board Layer Stackup Geometry
      2. 11.2.2 Recommended DLPC350 MOSC Crystal Oscillator Configuration
      3. 11.2.3 Recommended DLPC350 PLL Layout Configuration
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 视频时序参数定义
      2. 12.1.2 器件命名规则
      3. 12.1.3 器件标记
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 商标
    4. 12.4 Glossary
  13. 13机械、封装和可订购信息
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

4 修订历史记录

Changes from E Revision (February 2018) to F Revision

  • Added footnote specifying that signals are only captured at positive edge of P1A_CLK Go

Changes from D Revision (August 2016) to E Revision

  • Corrected LEDx_PWM and LEDx_EN descriptions in Pin Functions tableGo
  • Added information about pullup resistor requirements on USB_DAT_P and other USB clarifying notes in Pin Functions tableGo
  • Changed FAN_LOCKED pin to indicate it is unimplemented and FAM_PWM pin to indicate it is not user controllable in Pin Functions tableGo
  • Corrected DMD interface setup and hold timings to be minimum values and updated the corresponding noteGo
  • Updated "pulse-duration modulation" to "pulse width modulation" in Overview subsection of Detailed DescriptionGo
  • Updated language concerning structured light applications related to the buffer, trigger modes, and video algorithms; also added additional requirements related to the maximum pattern speed in Structured Light ApplicationsGo
  • Added Table 7, which lists summaries of trigger modes, and updated corresponding descriptionsGo
  • Added DMD_TRC and DMD_LOADB to Routing Priority tableGo
  • Deleted mention of spread-spectrum clock, which is not supportedGo
  • Added MSL Peak Temp to Packaging InformationGo

Changes from C Revision (September 2013) to D Revision

  • 将数据表的标题更改为“适用于 DLP4500 和 DLP4500NIR DMD 的 DLPC350 DLP 数字控制器”Go
  • 在特性Go
  • 将内部 RAM 空间更正为 64Mb 并删除了多余的“可存储多达 48 个 1 位图形”Go
  • 将“外部并行闪存”上移至要点中；将 64MB 更改为 32MBGo
  • Changed 将“视频投影模式”更改为“视频显示模式”Go
  • Deleted 删除了“丰富的视频处理功能”Go
  • 更改了说明中的 部分用词Go
  • Changed “NIR”改为“近红外 (NIR)”Go
  • Added 添加了 DLPR350 固件和 DLP4500 数据表的直接链接。Go
  • Changed Description field of I2C_ADDR_SEL in Pin Function DescriptionsGo
  • Changed I2C bus max to reference I2C0 and I2C1 Interface Timing Requirements in Pin Function Descriptions tableGo
  • Updated note on ICTSEN and TRST in description column of Pin Function Descriptions tableGo
  • Moved and changed "e.g. HDMI, BT656" in Pin Function Descriptions tableGo
  • Removed Machine Model ESD information from ESD RatingsGo
  • Changed Operating junction temperature to 105°C in Recommended Operating ConditionsGo
  • Changed table notes for I2C0 and I2C1 Interface Timing RequirementsGo
  • Added exception for 120 Hz source in Source Input BlankingGo
  • Added VSYNC and HSYNC high value to Table 3Go
  • Added Table 4Go
  • Added Figure 7Go
  • Added clarification on putting DLPC350 in tri-state during JTAG boundary scan in Board Level Test SupportGo
  • Changed 48 bit-plane" to "48 1-bit planesGo
  • Clarified wording about mapping options in (LVDS) Receiver Supported Pixel Mapping ModesGo
  • Added Link to DLPR350 firmware pageGo
  • Corrected flash access read and write timing to fixed valuesGo
  • Removed subsection Application Performance Plot and figure Go
  • Changed Figure 23 to reference DLPC350 and INIT_BUSY timing to 2.3 s max Go
  • 相关文档Go

Changes from B Revision (September 2013) to C Revision

  • 已更新至最新 TI 标准，并根据新数据表流程重新编排了内容Go
  • Clarified the description for POWER_ON_OFF pin in the Pin Function DescriptionsGo
  • Moved the pin descriptions as part of new data sheet flowGo
  • Removed empty Conditions column from Absolute Maximum RatingsGo
  • Separated the handling ratings from the absolute maximum ratingsGo
  • Removed empty Conditions column from the Recommended Operating Conditions tableGo
  • 添加了器件和文档支持 部分Go

Changes from A Revision (May 2013) to B Revision

  • Added PIB_CLK and P1C_CLK to Pin Function DescriptionsGo
  • Deleted PM_CS_0 from FLASH INTERFACE in Pin Function DescriptionsGo
  • Deleted Y16 and AB17 from the RESERVED PINS list in Pin Function DescriptionsGo
  • Added PM_CS_0 to the RESERVED PINS LIST in Pin Function DescriptionsGo
  • Deleted "PM_CS_0 - available for optional Flash device ( ≤ 128 Mb)" From the Program Memory Flash Interface section Go

Changes from * Revision (April 2013) to A Revision

  • 已将器件状态从“预览”更改为“生产”Go