ZHCSDJ3C March   2015  – June 2019 DLPC150

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      DLP 0.2 英寸 WVGA 芯片组
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
    2. 5.1 DLPC150 Mechanical Data
      1. Table 1. I/O Type Subscript Definition
      2. Table 2. Internal Pullup and Pulldown Characteristics
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics Over Recommended Operating Conditions
    6. 6.6  Electrical Characteristics
    7. 6.7  High-Speed Sub-LVDS Electrical Characteristics
    8. 6.8  Low-Speed SDR Electrical Characteristics
    9. 6.9  System Oscillators Timing Requirements
    10. 6.10 Power-Up and Reset Timing Requirements
    11. 6.11 Parallel Interface Frame Timing Requirements
    12. 6.12 Parallel Interface General Timing Requirements
    13. 6.13 Flash Interface Timing Requirements
  7. 7 Parameter Measurement Information
    1. 7.1 Host_irq Usage Model
    2. 7.2 Input Source
      1. 7.2.1 Parallel Interface Supports Two Data Transfer Formats
        1. 7.2.1.1 Pdata Bus – Parallel Interface Bit Mapping Modes
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Interface Timing Requirements
        1. 8.3.1.1 Parallel Interface
      2. 8.3.2 Serial Flash Interface
      3. 8.3.3 Serial Flash Programming
      4. 8.3.4 I2C Control Interface
      5. 8.3.5 DMD (Sub-LVDS) Interface
      6. 8.3.6 Calibration And Debug Support
      7. 8.3.7 DMD Interface Considerations
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DLPC150 System Design Consideration – Application Notes
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLPC150 System Interfaces
          1. 9.2.2.1.1 Control Interface
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 System Power-Up and Power-Down Sequence
    2. 10.2 DLPC150 Power-Up Initialization Sequence
    3. 10.3 DMD Fast Park Control (PARKZ)
    4. 10.4 Hot Plug Usage
    5. 10.5 Maximum Signal Transition Time
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Guidelines For Internal Controller PLL Power
      2. 11.1.2 DLPC150 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 General Handling Guidelines for Unused CMOS-Type Pins
      5. 11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths
      6. 11.1.6 Number of Layer Changes
      7. 11.1.7 Stubs
      8. 11.1.8 Terminations
      9. 11.1.9 Routing Vias
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件命名规则
        1. 12.1.1.1 器件标记
    2. 12.2 相关链接
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13"机械、封装和可订购信息
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)

11.1.5 Maximum Pin-to-Pin, PCB Interconnects Etch Lengths

Table 14. Max Pin-to-Pin PCB Interconnect Recommendations(1)(2)

DMD BUS SIGNAL SIGNAL INTERCONNECT TOPOLOGY UNIT
SINGLE BOARD SIGNAL ROUTING LENGTH MULTI-BOARD SIGNAL ROUTING LENGTH
DMD_HS_CLK_P
DMD_HS_CLK_N		 6.0
152.4		 See (3) inch
(mm)
DMD_HS_WDATA_A_P
DMD_HS_WDATA_A_N		 6.0
152.4		 See (3) inch
(mm)
DMD_HS_WDATA_B_P
DMD_HS_WDATA_B_N
DMD_HS_WDATA_C_P
DMD_HS_WDATA_C_N
DMD_HS_WDATA_D_P
DMD_HS_WDATA_D_N
DMD_HS_WDATA_E_P
DMD_HS_WDATA_E_N
DMD_HS_WDATA_F_P
DMD_HS_WDATA_F_N
DMD_HS_WDATA_G_P
DMD_HS_WDATA_G_N
DMD_HS_WDATA_H_P
DMD_HS_WDATA_H_N
DMD_LS_CLK 6.5
165.1		 See (3) inch
(mm)
DMD_LS_WDATA 6.5
165.1		 See (3) inch
(mm)
DMD_LS_RDATA 6.5
165.1		 See (3) inch
(mm)
DMD_DEN_ARSTZ 7.0
177.8		 See (3) inch
(mm)
(1) Max signal routing length includes escape routing.
(2) Multi-board DMD routing length is more restricted due to the impact of the connector.
(3) Due to board variations, these are impossible to define. Any board designs should SPICE simulate with the DLPC150 controller IBIS models to ensure single routing lengths do not exceed requirements.

Table 15. High Speed PCB Signal Routing Matching Requirements(2)(3)(4)(5)

SIGNAL GROUP LENGTH MATCHING
INTERFACE SIGNAL GROUP REFERENCE SIGNAL MAX MISMATCH(1) UNIT
DMD DMD_HS_WDATA_A_P
DMD_HS_WDATA_A_N		 DMD_HS_CLK_P
DMD_HS_CLK_N		 ±0.1
(±25.4)		 inch
(mm)
DMD_HS_WDATA_B_P
DMD_HS_WDATA_B_N
DMD_HS_WDATA_C_P
DMD_HS_WDATA_C_N
DMD_HS_WDATA_D_P
DMD_HS_WDATA_D_N
DMD_HS_WDATA_E_P
DMD_HS_WDATA_E_N
DMD_HS_WDATA_F_P
DMD_HS_WDATA_F_N
DMD_HS_WDATA_G_P
DMD_HS_WDATA_G_N
DMD_HS_WDATA_H_P
DMD_HS_WDATA_H_N
DMD DMD_LS_WDATA
DMD_LS_RDATA		 DMD_LS_CLK ±0.2
(±5.08)		 inch
(mm)
DMD DMD_DEN_ARSTZ N/A N/A inch
(mm)
(1) Mismatch variance applies to high-speed data pairs. For all high-speed data pairs, the maximum mismatch between pairs should be 1 mm or less.
(2) These values apply to PCB routing only. They do not include any internal package routing mismatch associated with the DLPC150, the DMD.
(3) DMD HS data lines are differential, thus these specifications are pair-to-pair.
(4) Training is applied to DMD HS data lines, so defined matching requirements are slightly relaxed.
(5) DMD LS signals are single ended.