ZHCSIA7 May   2018 DLPA4000

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      系统方框图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Parameters
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Description
    3. 7.3 Feature Description
      1. 7.3.1 Supply and Monitoring
        1. 7.3.1.1 Supply
        2. 7.3.1.2 Monitoring
          1. 7.3.1.2.1 Block Faults
          2. 7.3.1.2.2 Low Battery and UVLO
          3. 7.3.1.2.3 Thermal Protection
      2. 7.3.2 Illumination
        1. 7.3.2.1 Programmable Gain Block
        2. 7.3.2.2 LDO Illumination
        3. 7.3.2.3 Illumination Driver A
        4. 7.3.2.4 External MOSFETs
          1. 7.3.2.4.1 Gate series resistor (RG)
          2. 7.3.2.4.2 Gate series diode (DG)
          3. 7.3.2.4.3 Gate parallel capacitance (CG)
        5. 7.3.2.5 RGB Strobe Decoder
          1. 7.3.2.5.1 Break Before Make (BBM)
          2. 7.3.2.5.2 Openloop Voltage
          3. 7.3.2.5.3 Transient Current Limit
        6. 7.3.2.6 Illumination Monitoring
          1. 7.3.2.6.1 Power Good
          2. 7.3.2.6.2 RatioMetric Overvoltage Protection
      3. 7.3.3 External Power MOSFET Selection
        1. 7.3.3.1 Threshold Voltage
        2. 7.3.3.2 Gate Charge and Gate Timing
        3. 7.3.3.3 On-resistance RDS(on)
      4. 7.3.4 DMD Supplies
        1. 7.3.4.1 LDO DMD
        2. 7.3.4.2 DMD HV Regulator
        3. 7.3.4.3 DMD/DLPC Buck Converters
        4. 7.3.4.4 DMD Monitoring
          1. 7.3.4.4.1 Power Good
          2. 7.3.4.4.2 Overvoltage Fault
      5. 7.3.5 Buck Converters
        1. 7.3.5.1 LDO Bucks
        2. 7.3.5.2 General Purpose Buck Converters
        3. 7.3.5.3 Buck Converter Monitoring
          1. 7.3.5.3.1 Power Good
          2. 7.3.5.3.2 Overvoltage Fault
      6. 7.3.6 Auxiliary LDOs
      7. 7.3.7 Measurement System
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 SPI
      2. 7.5.2 Interrupt
      3. 7.5.3 Fast-Shutdown in Case of Fault
      4. 7.5.4 Protected Registers
      5. 7.5.5 Writing to EEPROM
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection for General-Purpose Buck Converters
    3. 8.3 System Example With DLPA4000 Internal Block Diagram
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up and Power-Down Timing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 LED Driver
        1. 10.1.1.1 PowerBlock Gate Control Isolation
        2. 10.1.1.2 VIN to PowerBlocks
        3. 10.1.1.3 Return Current from LEDs and RSense
        4. 10.1.1.4 RC Snubber
        5. 10.1.1.5 Capacitor Choice
      2. 10.1.2 General Purpose Buck 2
      3. 10.1.3 SPI Connections
      4. 10.1.4 RLIM Routing
      5. 10.1.5 LED Connection
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 器件命名规则
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.1.1.4 RC Snubber

Proper operation requires snubber networks. The switching frequency can vary from several hundreds of kHz to frequencies in the MHz range. To switch currents from zero to several amperes requires only nanoseconds, equivalent to even much higher frequencies. EMI can occur when ringing occurs on the edges. This ringing can have higher amplitude and frequency than the switching voltage. All DLP4000 buck converters require a snubber network to prevent ringing. The snubber network comprises a resistor and a capacitor in series.

Place an R-C snubber network (C32 and R56) to reduce ringing on the switching node. Place the capacitor on top of a large plane for the switching node directly next to the PGND plane. This resistor placement eliminates the gap between the switching node and the PGND plane used by the PowerBlocks.

DLPA4000 DLPA4000_RC_Snubber_Layout.gifFigure 29. RC Snubber Layout