ZHCSC19B January   2014  – March 2022 CSD25310Q2

PRODUCTION DATA  

  1. 1特性
  2. 2应用
  3. 3说明
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q2 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q2 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DQK|6
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision A (June 2014) to Revision B (March 2022)

  • Updated drain and source connection images.Go

Changes from Revision * (January 2014) to Revision A (June 2014)

  • 已将“无铅端子镀层”修改为唯一状态“无铅”Go
  • 在订购信息表中添加了小卷带选项Go