ZHCSQD6 March   2022 CC2651P3

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RKP Package (Top View)
    4. 7.4 Signal Descriptions – RKP Package
    5. 7.5 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.14.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparator
        1. 8.15.4.1 Continuous Time Comparator
      5. 8.15.5 GPIO
        1. 8.15.5.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee and 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
  • RKP|40
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.16.3 TX Current

Figure 8-8 TX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz)
GUID-37C7702E-BDA2-4A09-9012-624004D2D814-low.gif
Figure 8-10 TX Current vs. Temperature (250 kbps, 2.44 GHz, +10 dBm PA)
GUID-8B16650C-A0C3-4344-BF94-22D3E746EBBB-low.gif
Figure 8-12 TX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz, +20 dBm PA)
GUID-CC0C113D-010E-44B9-896C-45B826FB6AEB-low.gif
Figure 8-9 TX Current vs. Temperature (BLE 1 Mbps, 2.44 GHz, VDDS = 3.3 V)
Figure 8-11 TX Current vs. Supply Voltage (VDDS) (BLE 1 Mbps, 2.44 GHz)
GUID-C6AF6D8D-1FE8-42B0-A250-9FF89E18FC73-low.gif
Figure 8-13 TX Current vs. Supply Voltage (VDDS) (250 kbps, 2.44 GHz, +10 dBm PA)
Table 8-1 Typical TX Current and Output Power, regular PA
CC2651P3 at 2.4 GHz, VDDS = 3.0 V (Measured on CC2651-P3EM-7XD24-PA24)
txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA]
0x701F 5 5.5 12.5
0x3A17 4 4.5 11.9
0x3A64 3 3.1 11.2
0x325F 2 2.0 10.8
0x2C5C 1 1.3 10.5
0x2659 0 0.4 10.2
0x1697 -3 -2.8 9.4
0x1693 -5 -4.8 8.9
0x1292 -6 -5.4 8.8
0xCD3 -9 -9.0 8.4
0xAD1 -10 -10.4 8.2
0xACF -12 -12.0 8.1
0x6CD -15 -13.7 7.9
0x6CA -18 -16.8 7.7
0x4C8 -20 -19.3 7.6
Table 8-2 Typical TX Current and Output Power, high power PA, 10 dBm mode
CC2651P3 at 2.4 GHz, VDDS = 3.0 V (Measured on CC261-P3EM-5XS24-PA24_10dBm)
txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA]
0x14395A 10 10.1 23.6
0x142F55 9 9.0 22.1
0x62F35 8 7.8 21.1
0x63930 7 6.9 20.1
0x6292B 6 5.9 19.1
Table 8-3 Typical TX Current and Output Power, high power PA, 20 dBm mode
CC2651P3 at 2.4 GHz, VDDS = 3.3 V (Measured on CC2651-P3EM-7XD24-PA24)
txPower TX Power Setting (SmartRF Studio) Typical Output Power [dBm] Typical Current Consumption [mA]
0x3F75F5 20 20.0 100.1
0x3F61E2 19 19.4 91.1
0x3047E0 18 19.0 86.4
0x1B4FE5 17 18.1 78.3
0x1B39DE 16 17.3 71.8
0x1B2FDA 15 16.7 67.1
0x1B27D6 14 15.9 61.8