ZHCSQD6 March   2022 CC2651P3

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RKP Package (Top View)
    4. 7.4 Signal Descriptions – RKP Package
    5. 7.5 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 Bluetooth Low Energy - Receive (RX)
    11. 8.11 Bluetooth Low Energy - Transmit (TX)
    12. 8.12 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    13. 8.13 Zigbee - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    14. 8.14 Timing and Switching Characteristics
      1. 8.14.1 Reset Timing
      2. 8.14.2 Wakeup Timing
      3. 8.14.3 Clock Specifications
        1. 8.14.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.14.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.14.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.14.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.14.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.14.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       37
      5. 8.14.5 UART
        1. 8.14.5.1 UART Characteristics
    15. 8.15 Peripheral Characteristics
      1. 8.15.1 ADC
        1. 8.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.15.2 DAC
        1. 8.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.15.3 Temperature and Battery Monitor
        1. 8.15.3.1 Temperature Sensor
        2. 8.15.3.2 Battery Monitor
      4. 8.15.4 Comparator
        1. 8.15.4.1 Continuous Time Comparator
      5. 8.15.5 GPIO
        1. 8.15.5.1 GPIO DC Characteristics
    16. 8.16 Typical Characteristics
      1. 8.16.1 MCU Current
      2. 8.16.2 RX Current
      3. 8.16.3 TX Current
      4. 8.16.4 RX Performance
      5. 8.16.5 TX Performance
      6. 8.16.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Bluetooth 5.2 Low Energy
      2. 9.3.2 802.15.4 (Zigbee and 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGZ|48
  • RKP|40
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Signal Descriptions – RKP Package

Table 7-2 Signal Descriptions – RKP Package
PIN I/O TYPE DESCRIPTION
NAME NO.
DCDC_SW 25 — Power Output from internal DC/DC converter(1)
DCOUPL 17 — Power For decoupling of internal 1.27 V regulated digital-supply (3)
DIO_5 10 I/O Digital GPIO, high-drive capability
DIO_6 11 I/O Digital GPIO, high-drive capability
DIO_7 12 I/O Digital GPIO, high-drive capability
DIO_8 14 I/O Digital GPIO
DIO_9 15 I/O Digital GPIO
DIO_10 20 I/O Digital GPIO, JTAG_TDO, high-drive capability
DIO_11 21 I/O Digital GPIO, JTAG_TDI, high-drive capability
DIO_12 22 I/O Digital GPIO
DIO_13 23 I/O Digital GPIO
DIO_14 24 I/O Digital GPIO
DIO_15 28 I/O Digital GPIO, analog capability
DIO_16 29 I/O Digital GPIO, analog capability
DIO_17 30 I/O Digital GPIO, analog capability
DIO_18 31 I/O Digital GPIO, analog capability
DIO_19 32 I/O Digital GPIO, analog capability
DIO_20 33 I/O Digital GPIO, analog capability
DIO_21 34 I/O Digital GPIO, analog capability
DIO_22 35 I/O Digital GPIO, analog capability
EGP — — GND Ground – exposed ground pad(5)
JTAG_TSMC 18 I/O Digital JTAG TMSC, high-drive capability
JTAG_TCKC 19 I Digital JTAG TCKC
RESET_N 27 I Digital Reset, active low. No internal pullup resistor
RF_P 1 — RF Positive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RF_N 2 — RF Negative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RX_TX 7 — RF Optional bias pin for the RF LNA
TX_20DBM_P 5 — RF Positive high-power TX signal
TX_20DBM_N 6 — RF Negative high-power TX signal
VDDR 37 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(3)(7)(11)
VDDR_RF 40 — Power Internal supply, must be powered from the internal DC/DC converter or the internal LDO(3)(9)(11)
VDDS 36 — Power 1.8-V to 3.8-V main chip supply(1)
VDDS2 13 — Power 1.8-V to 3.8-V DIO supply(1)
VDDS3 16 — Power 1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC 26 — Power 1.8-V to 3.8-V DC/DC converter supply
X48M_N 38 — Analog 48-MHz crystal oscillator pin 1
X48M_P 39 — Analog 48-MHz crystal oscillator pin 2
X32K_Q1 8 — Analog 32-kHz crystal oscillator pin 1
X32K_Q2 9 — Analog 32-kHz crystal oscillator pin 2
(1) For more details, see the device technical reference manual listed in Section 11.3.
(3) Do not supply external circuitry from this pin.
(5) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(7) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(9) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(11) Output from internal DC/DC and LDO is trimmed to 1.68 V.