ZHCSFW7C december   2016  – september 2020 CC2640R2F

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RHB Package
    4. 7.4 Signal Descriptions – RHB Package
    5. 7.5 Pin Diagram – YFV (Chip Scale, DSBGA) Package
    6. 7.6 Signal Descriptions – YFV (Chip Scale, DSBGA) Package
    7. 7.7 Pin Diagram – RSM Package
    8. 7.8 Signal Descriptions – RSM Package
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Consumption Summary
    5. 8.5  General Characteristics
    6. 8.6  125-kbps Coded (Bluetooth 5) – RX
    7. 8.7  125-kbps Coded (Bluetooth 5) – TX
    8. 8.8  500-kbps Coded (Bluetooth 5) – RX
    9. 8.9  500-kbps Coded (Bluetooth 5) – TX
    10. 8.10 1-Mbps GFSK (Bluetooth low energy) – RX
    11. 8.11 1-Mbps GFSK (Bluetooth low energy) – TX
    12. 8.12 2-Mbps GFSK (Bluetooth 5) – RX
    13. 8.13 2-Mbps GFSK (Bluetooth 5) – TX
    14. 8.14 24-MHz Crystal Oscillator (XOSC_HF)
    15. 8.15 32.768-kHz Crystal Oscillator (XOSC_LF)
    16. 8.16 48-MHz RC Oscillator (RCOSC_HF)
    17. 8.17 32-kHz RC Oscillator (RCOSC_LF)
    18. 8.18 ADC Characteristics
    19. 8.19 Temperature Sensor
    20. 8.20 Battery Monitor
    21. 8.21 Continuous Time Comparator
    22. 8.22 Low-Power Clocked Comparator
    23. 8.23 Programmable Current Source
    24. 8.24 Synchronous Serial Interface (SSI)
    25. 8.25 DC Characteristics
    26. 8.26 Thermal Resistance Characteristics
    27. 8.27 Timing Requirements
    28. 8.28 Switching Characteristics
    29. 8.29 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  Functional Block Diagram
    3. 9.3  Main CPU
    4. 9.4  RF Core
    5. 9.5  Sensor Controller
    6. 9.6  Memory
    7. 9.7  Debug
    8. 9.8  Power Management
    9. 9.9  Clock Systems
    10. 9.10 General Peripherals and Modules
    11. 9.11 Voltage Supply Domains
    12. 9.12 System Architecture
  10. 10Application, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 5 × 5 External Differential (5XD) Application Circuit
      1. 10.2.1 Layout
    3. 10.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 10.3.1 Layout
  11. 11Device and Documentation Support
    1. 11.1  Device Nomenclature
    2. 11.2  Tools and Software
    3. 11.3  Documentation Support
    4. 11.4  Texas Instruments Low-Power RF Website
    5. 11.5  Low-Power RF eNewsletter
    6. 11.6  支持资源
    7. 11.7  Trademarks
    8. 11.8  静电放电警告
    9. 11.9  Export Control Notice
    10. 11.10 术语表
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RSM|32
  • RGZ|48
  • RHB|32
  • YFV|34
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.2 Signal Descriptions – RGZ Package

Table 7-1 Signal Descriptions – RGZ Package
NAMENO.TYPEDESCRIPTION
DCDC_SW33PowerOutput from internal DC/DC(1)
DCOUPL23Power1.27-V regulated digital-supply decoupling capacitor(2)
DIO_05Digital I/OGPIO, Sensor Controller
DIO_16Digital I/OGPIO, Sensor Controller
DIO_27Digital I/OGPIO, Sensor Controller
DIO_38Digital I/OGPIO, Sensor Controller
DIO_49Digital I/OGPIO, Sensor Controller
DIO_510Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_611Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_712Digital I/OGPIO, Sensor Controller, high-drive capability
DIO_814Digital I/OGPIO
DIO_915Digital I/OGPIO
DIO_1016Digital I/OGPIO
DIO_1117Digital I/OGPIO
DIO_1218Digital I/OGPIO
DIO_1319Digital I/OGPIO
DIO_1420Digital I/OGPIO
DIO_1521Digital I/OGPIO
DIO_1626Digital I/OGPIO, JTAG_TDO, high-drive capability
DIO_1727Digital I/OGPIO, JTAG_TDI, high-drive capability
DIO_1828Digital I/OGPIO
DIO_1929Digital I/OGPIO
DIO_2030Digital I/OGPIO
DIO_2131Digital I/OGPIO
DIO_2232Digital I/OGPIO
DIO_2336Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2437Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2538Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2639Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2740Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2841Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_2942Digital/Analog I/OGPIO, Sensor Controller, Analog
DIO_3043Digital/Analog I/OGPIO, Sensor Controller, Analog
JTAG_TMSC24Digital I/OJTAG TMSC, high-drive capability
JTAG_TCKC25Digital I/OJTAG TCKC(3)
RESET_N35Digital inputReset, active-low. No internal pullup.
RF_P1RF I/OPositive RF input signal to LNA during RX
Positive RF output signal to PA during TX
RF_N2RF I/ONegative RF input signal to LNA during RX
Negative RF output signal to PA during TX
VDDR45Power1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2)(4)
VDDR_RF48Power1.7-V to 1.95-V supply, typically connect to output of internal DC/DC(2)(5)
VDDS44Power1.8-V to 3.8-V main chip supply(1)
VDDS213Power1.8-V to 3.8-V DIO supply(1)
VDDS322Power1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC34Power1.8-V to 3.8-V DC/DC supply
X32K_Q13Analog I/O32-kHz crystal oscillator pin 1
X32K_Q24Analog I/O32-kHz crystal oscillator pin 2
X24M_N46Analog I/O24-MHz crystal oscillator pin 1
X24M_P47Analog I/O24-MHz crystal oscillator pin 2
EGPPowerGround – Exposed Ground Pad
(1) For more details, see the technical reference manual (listed in Section 11.3).
(2) Do not supply external circuitry from this pin.
(3) For design consideration regarding noise immunity for this pin, see the JTAG Interface chapter in the CC13x0, CC26x0 SimpleLink™ Wireless MCU Technical Reference Manual
(4) If internal DC/DC is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC is not used, this pin must be connected to VDDR for supply from the main LDO.