SWRS349 June   2026 CC2340R5MODA

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Functional Block Diagram
6. 5 Device Comparison
7. 6 Pin Configurations and Functions
   1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram - MHA Package (Top View)
   2.     10
   3. 6.2 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
      13.      24
      14.      25
      15.      26
      16.      27
   4. 6.3 Connections for Unused Pins and Modules
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  DCDC
   5. 7.5  Global LDO (GLDO)
   6. 7.6  Power Supply and Modules
   7. 7.7  Battery Monitor
   8. 7.8  Temperature Sensor
   9. 7.9  Power Consumption - Power Modes
   10. 7.10 Power Consumption - Radio Modes
   11. 7.11 Nonvolatile (Flash) Memory Characteristics
   12. 7.12 Thermal Resistance Characteristics
   13. 7.13 RF Frequency Bands
   14. 7.14 Bluetooth Low Energy - Receive (RX)
   15. 7.15 Bluetooth Low Energy - Transmit (TX)
   16. 7.16 2.4GHz RX/TX CW
   17. 7.17 Timing and Switching Characteristics
       1. 7.17.1 Reset Timing
       2. 7.17.2 Wakeup Timing
       3. 7.17.3 Clock Specifications
          1. 7.17.3.1 48MHz Crystal Oscillator (HFXT)
          2. 7.17.3.2 48MHz RC Oscillator (HFOSC)
          3. 7.17.3.3 32kHz Crystal Oscillator (LFXT)
          4. 7.17.3.4 32kHz RC Oscillator (LFOSC)
   18. 7.18 Peripheral Characteristics
       1. 7.18.1 UART
          1. 7.18.1.1 UART Characteristics
       2. 7.18.2 SPI
          1. 7.18.2.1 SPI Characteristics
          2. 7.18.2.2 SPI Controller Mode
          3. 7.18.2.3 SPI Timing Diagrams - Controller Mode
          4. 7.18.2.4 SPI Peripheral Mode
          5. 7.18.2.5 SPI Timing Diagrams - Peripheral Mode
       3. 7.18.3 I2C
          1. 7.18.3.1 I2C
          2. 7.18.3.2 I2C Timing Diagram
       4. 7.18.4 GPIO
          1. 7.18.4.1 GPIO DC Characteristics
       5. 7.18.5 ADC
          1. 7.18.5.1 Analog-to-Digital Converter (ADC) Characteristics
       6. 7.18.6 Comparators
          1. 7.18.6.1 Ultra-low power comparator
   19. 7.19 Typical Characteristics
       1. 7.19.1 MCU Current
       2. 7.19.2 RX Current
       3. 7.19.3 TX Current
       4. 7.19.4 RX Performance
       5. 7.19.5 TX Performance
       6. 7.19.6 ADC Performance
9. 8 Detailed Description
   1. 8.1  Overview
   2. 8.2  System CPU
   3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
   4. 8.4  Memory
   5. 8.5  Cryptography
   6. 8.6  Timers
   7. 8.7  Serial Peripherals and I/O
   8. 8.8  Battery and Temperature Monitor
   9. 8.9  µDMA
   10. 8.10 Debug
   11. 8.11 Power Management
   12. 8.12 Clock Systems
   13. 8.13 Network Processor
   14. 8.14 Device Certification and Qualification
       1. 8.14.1 FCC Certification and Statement
       2. 8.14.2 IC/ISED Certification and Statement
       3. 8.14.3 ETSI/CE Certification
   15. 8.15 Module Markings
   16. 8.16 End Product Labeling
   17. 8.17 Manual Information to the End User
10. 9 Application, Implementation, and Layout
    1. 9.1 Typical Application Circuit
    2. 9.2 Device Connections
       1. 9.2.1 Unused Pins
    3. 9.3 PCB Layout Guidelines
       1. 9.3.1 General Layout Recommendations
          1. 9.3.1.1 Typical RF Layout Recommendations with Integrated Antenna
          2. 9.3.1.2 RF Layout Recommendations with External Antenna
    4. 9.4 Reference Designs
11. 10Environmental Requirements and SMT Specifications
    1. 10.1 PCB Bending
    2. 10.2 Handling Environment
       1. 10.2.1 Terminals
       2. 10.2.2 Falling
    3. 10.3 Storage Condition
       1. 10.3.1 Moisture Barrier Bag Before Opened
       2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
       1. 10.4.1 PCB Land Pattern & Thermal Vias
       2. 10.4.2 SMT Assembly Recommendations
       3. 10.4.3 PCB Surface Finish Requirements
       4. 10.4.4 Solder Stencil
       5. 10.4.5 Package Placement
       6. 10.4.6 Solder Joint Inspection
       7. 10.4.7 Rework and Replacement
       8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 SMT Recommendations
12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
       1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
13. 12Revision History
14. 13Mechanical, Packaging, and Orderable Information