ZHCSPB8A December   2021  – June 2022 BQ77207

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 规格
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 DC Characteristics
    6. 8.6 Timing Requirements
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Voltage Fault Detection
      2. 9.3.2 Open Wire Fault Detection
      3. 9.3.3 Temperature Fault Detection
      4. 9.3.4 Oscillator Health Check
      5. 9.3.5 Sense Positive Input for Vx
      6. 9.3.6 Output Drive, COUT and DOUT
      7. 9.3.7 The LATCH Function
      8. 9.3.8 Supply Input, VDD
    4. 9.4 Device Functional Modes
      1. 9.4.1 NORMAL Mode
      2. 9.4.2 FAULT Mode
      3. 9.4.3 Customer Test Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Design Requirements
      2. 10.1.2 Detailed Design Procedure
        1. 10.1.2.1 Cell Connection Sequence
    2. 10.2 Systems Example
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 第三方产品免责声明
    2. 13.2 接收文档更新通知
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
DSS
12 PINS
RθJA Junction-to-ambient thermal resistance 67.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.6 °C/W
RθJB Junction-to-board thermal resistance 35.9 °C/W
ΨJT Junction-to-top characterization parameter 2.9 °C/W
ΨJB Junction-to-board characterization parameter 35.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 14 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.