ZHCSJP5B May   2019  – October 2021 ALM2402F-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 12 V
    6. 6.6 Electrical Characteristics: VS = 5 V
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 OTF/SH_DN
      2. 7.3.2 Output Stage Supply Voltage
      3. 7.3.3 Current-Limit and Short-Circuit Protection
      4. 7.3.4 Input Common-Mode Overvoltage Clamps
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Output Stage
      7. 7.3.7 EMI Susceptibility and Input Filtering
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open-Loop and Closed-Loop Operation
      2. 7.4.2 Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Load and Stability
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resolver Excitation Input (Op Amp Output)
          1. 8.2.2.1.1 Excitation Voltage
          2. 8.2.2.1.2 Excitation Frequency
          3. 8.2.2.1.3 Excitation Impedance
        2. 8.2.2.2 Resolver Output
        3. 8.2.2.3 Power Dissipation and Thermal Reliability
          1. 8.2.2.3.1 Improving Package Thermal Performance
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Information

THERMAL METRIC(1) ALM2402FQ1 UNIT
PWP (TSSOP)
14 PINS
RθJA Junction-to-ambient thermal resistance 46.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.0 °C/W
RθJB Junction-to-board thermal resistance 27.6 °C/W
ψJT Junction-to-top characterization parameter 1.5 °C/W
ψJB Junction-to-board characterization parameter 27.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.2 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.