SLWS214C
October 2008 – May 2026
ADS61B29
,
ADS61B49
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
4.1
Pin Configuration and Functions (LVDS Mode) — ADS61B49 and ADS61B29
4.2
Pin Configuration and Functions (CMOS Mode) – ADS61B49 and ADS61B29
5
Specifications
5.1
Absolute Maximum Ratings
5.2
Recommended Operating Conditions
5.3
Electrical Characteristics – ADS61B49 and ADS61B29
5.4
Electrical Characteristics – ADS61B49 and ADS61B29
5.5
Electrical Characteristics – ADS61B49 and ADS61B29
5.6
Digital Characteristics – ADS61B49 and ADS61B29
5.7
Timing Requirements – LVDS and CMOS Modes
5.8
Typical Characteristics - ADS61B49
5.9
Typical Characteristics - ADS61B29
5.10
Typical Characteristics - Common Plots (both ADS61B49/61B29)
5.11
Contour Plots - ADS61B49/ADS61B29
5.12
Contour Plots - ADS61B49
5.13
Contour Plots - ADS61B29
6
Detailed Description
6.1
Functional Block Diagrams
6.1.1
ADS61B29 Block Diagram
6.1.2
ADS61B49 Block Diagram
6.2
Feature Description
6.2.1
Device Configuration
6.2.2
Parallel Configuration Only
6.2.3
Serial Interface Configuration Only
6.2.4
Configuration Using Both The Serial Interface and Parallel Controls
6.2.5
Description of Parallel Pins
6.2.6
Serial Interface
6.2.6.1
Register Initialization
6.2.7
Serial Interface Timing Characteristics
6.2.8
Serial Register Readout
6.2.9
Reset Timing
6.3
Serial Register Map
6.3.1
Description of Serial Registers
7
Application and Implementation
7.1
Application Information
7.1.1
Theory of Operation
7.1.2
Analog Input
7.1.2.1
Drive Circuit Requirements
7.1.2.2
Driving Circuit
7.1.2.3
Input Common-Mode
7.1.3
Reference
7.1.4
Clock Input
7.1.5
Fine Gain Control
7.1.6
Offset Correction
7.1.7
Power Down
7.1.7.1
Power-Down Global
7.1.7.2
Standby
7.1.7.3
Output Buffer Disable
7.1.7.4
Input Clock Stop
7.1.8
Power Supply Sequence
7.1.9
Digital Output Information
7.1.9.1
Output Interface
7.1.9.2
DDR LVDS Outputs
7.1.9.3
LVDS Buffer
7.1.9.4
Parallel CMOS Interface
7.1.9.5
Output Buffer Strength Programmability
7.1.9.6
CMOS Interface Power Dissipation
7.1.9.7
Output Data Format
7.1.10
Board Design Considerations
7.1.10.1
Grounding
7.1.10.2
Supply Decoupling
7.1.10.3
Exposed Pad
7.1.11
Definition of Specifications
8
Device and Documentation Support
8.1
Third-Party Products Disclaimer
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RGZ|48
MPQF123F
散热焊盘机械数据 (封装 | 引脚)
RGZ|48
QFND131R
订购信息
slws214c_oa
7.1.10
Board Design Considerations