ZHCU578 October   2018

 

  1.    说明
  2.    资源
  3.    特性
  4.    应用
  5.    设计图像
  6. 1System Description
    1. 1.1 Key System Specifications
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 TPS92692-Q1
    3. 2.3 LM74700
    4. 2.4 System Design Theory
      1. 2.4.1 Design Procedure
        1. 2.4.1.1  Operating Parameters, Duty Cycle
        2. 2.4.1.2  Setting the Switching Frequency
        3. 2.4.1.3  Inductor Value Calculation
        4. 2.4.1.4  Peak Inductor Current
        5. 2.4.1.5  Calculating RIS (R9)
        6. 2.4.1.6  Minimum Output Capacitance
        7. 2.4.1.7  Setting the LED Current
        8. 2.4.1.8  Soft-Start Capacitor
        9. 2.4.1.9  Overvoltage Protection (OVP)
        10. 2.4.1.10 Main N-Channel MOSFET Selection
        11. 2.4.1.11 Rectifier Diode Selection
        12. 2.4.1.12 Thermal Protection
      2. 2.4.2 Designing for Low EMI
        1. 2.4.2.1 EMI Performance
        2. 2.4.2.2 EMI Filter Design
          1. 2.4.2.2.1 Additional EMI Considerations
  8. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Required Hardware and Software
    2. 3.2 Testing and Results
      1. 3.2.1 Test Setup
      2. 3.2.2 Test Results
        1. 3.2.2.1 Nominal Operation Waveforms
          1. 3.2.2.1.1 Loop Stability Measurements Block Diagram
        2. 3.2.2.2 Efficiency and Line Regulation: Done for different power level for Boost (Hi Beam and Lo Beam) or Boost to Battery for Lo Beam only
        3. 3.2.2.3 Thermal Scan
  9. 4Design Files
    1. 4.1 Schematics
    2. 4.2 Bill of Materials
    3. 4.3 Layout Prints
    4. 4.4 Altium Project
    5. 4.5 Gerber Files
    6. 4.6 Assembly Drawings
  10. 5Related Documentation
    1. 5.1 商标

2.4.2.2.1 Additional EMI Considerations

  • Higher power levels may likely require increased EMI filtering to pass CISPR-25 class 5 limits. For lower power levels EMI filtering can also be reduced for cost reduction.
  • Options include increasing input capacitance or output capacitance (or both), adding ferrite bead resistance to mitigate high-frequency EMI, or increasing input and output choke inductance for common-mode noise reduction