ZHCSSM4E August   1999  – March 2024 TPS766

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information (Legacy Chip)
    5. 5.5 Thermal Information (New Chip)
    6. 5.6 Electrical Characteristics
    7. 5.7 Timing Diagram
    8. 5.8 Typical Characteristics
    9. 5.9 Typical Characteristics: Supported ESR Range
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Power-Good Function
      6. 6.3.6 Output Pulldown
      7. 6.3.7 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Device Functional Mode Comparison
      2. 6.4.2 Normal Operation
      3. 6.4.3 Dropout Operation
      4. 6.4.4 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Adjustable Device Feedback Resistors
        2. 7.2.2.2 Recommended Capacitor Types
        3. 7.2.2.3 Input and Output Capacitor Requirements
        4. 7.2.2.4 Reverse Current
        5. 7.2.2.5 Feed-Forward Capacitor (CFF)
        6. 7.2.2.6 Power Dissipation (PD)
        7. 7.2.2.7 Estimating Junction Temperature
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power-Good Function

The power-good circuit monitors the voltage at the output pin to indicate the health of the LDO output. When the output voltage falls below the PG threshold voltage (PGTH), the PG pin open-drain output engages and pulls the PG pin close to GND. When the output voltage exceeds PGTH + PGHysteresis, the PG pin becomes high impedance. The open-drain output requires a pullup resistor. By connecting a pullup resistor to an external supply, any downstream device receives power-good as a logic signal for use in sequencing. Additionally, tie the open-drain output to other open-drain outputs to implement an AND logic. Make sure that the external pullup supply voltage results in a valid logic signal for the receiving device.

When using a feed-forward capacitor (CFF), the time constant for the LDO start-up is increased but the power-good output time constant stays the same, possibly resulting in an invalid status of the power-good output. To avoid this issue, and to receive a valid PG output, make sure that the time constant of both the LDO start-up and the power-good output match. This matching is done by adding a capacitor in parallel with the power-good pullup resistor. For more information, see the Pros and Cons of Using a Feedforward Capacitor with a Low-Dropout Regulator application note.

The state of PG is only valid when the device operates above the minimum input voltage of the device and power-good is asserted, regardless of the output voltage state when the input voltage falls below the UVLO threshold minus the UVLO hysteresis. When the input voltage falls below approximately 0.8V, there is not enough gate drive voltage to keep the open-drain, power-good device turned on and the power-good output pulled high. Connecting the power-good pullup resistor to the output voltage helps minimize this effect.