ZHCSSM4E 数据表 | 德州仪器 TI.com.cn

ZHCSSM4E August 1999 – March 2024 TPS766

PRODUCTION DATA

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)

D|8

散热焊盘机械数据 (封装 | 引脚)

订购信息

5.8 Typical Characteristics

Figure 5-2 TPS76633 Output Voltage vs Load Current
(Legacy Chip)

Figure 5-4 TPS76633 Output Voltage vs Load Current
(New Chip)

Figure 5-6 TPS76633 Output Voltage vs Free-Air Temperature (Legacy Chip)

Figure 5-8 TPS76615 Output Voltage vs Free-Air Temperature (Legacy Chip)

Figure 5-10 TPS76633 Ground Current vs Load Current
(New Chip)

Figure 5-12 TPS76615 Ground Current vs Load Current
(Legacy Chip)

Figure 5-14 TPS76633 Ground Current vs Free-Air Temperature (New Chip)

Figure 5-16 TPS76615 Ground Current vs Free-Air Temperature (Legacy Chip)

Figure 5-18 TPS76633 Current Limit vs Input Voltage
(New Chip)

Figure 5-20 TPS76650 Dropout Voltage vs Free-Air Temperature (Legacy Chip)

Figure 5-22 TPS76633 Dropout Voltage vs Free-Air Temperature (Legacy Chip)

Figure 5-24 TPS76633 Power-Supply Ripple Rejection vs Frequency (Legacy Chip)

Figure 5-26 TPS76633 Power-Supply Ripple Rejection vs Frequency and Output Capacitor (New Chip)

Figure 5-28 TPS76633 Output Spectral Noise Density vs Frequency (Legacy Chip)

Figure 5-30 TPS76633 Output Spectral Noise Density vs Frequency and Output Capacitor (New Chip)

Figure 5-32 TPS76633 Output Impedance vs Frequency (Legacy Chip)

Figure 5-34 TPS76633 Line Transient Response (Legacy Chip)

Figure 5-36 TPS76633 Line Transient Response (New Chip)

Figure 5-38 TPS76633 Load Transient Response (Legacy Chip)

Figure 5-40 TPS76633 Load Transient Response (New Chip)

Start-up with EN sequencing

Figure 5-42 TPS76633 Output Voltage vs Time (New Chip)

Start-up with V_IN sequencing

Figure 5-44 TPS76633 Output Voltage vs Time (New Chip)

Figure 5-46 TPS76601 Dropout Voltage vs Input Voltage (Legacy Chip)

Figure 5-3 TPS76633 Output Voltage vs Load Current
(New Chip)

Figure 5-5 TPS76615 Output Voltage vs Load Current
(Legacy Chip)

Figure 5-7 TPS76633 Output Voltage vs Free-Air Temperature (New Chip)

Figure 5-9 TPS76633 Ground Current vs Load Current
(Legacy Chip)

Figure 5-11 TPS76633 Ground Current vs Load Current
(New Chip)

Figure 5-13 TPS76633 Ground Current vs Free-Air Temperature (Legacy Chip)

Figure 5-15 TPS76633 Ground Current vs Free-Air Temperature (New Chip)

Figure 5-17 TPS76633 Ground Current vs Input Voltage
(New Chip)

V_OUT = 3.3 V

Figure 5-19 TPS76633 Current Limit vs Output Voltage
(New Chip)

Figure 5-21 TPS76650 Dropout Voltage vs Free-Air Temperature (New Chip)

Figure 5-23 TPS76633 Dropout Voltage vs Free-Air Temperature (New Chip)

Figure 5-25 TPS76633 Power-Supply Ripple Rejection vs Frequency and Load Current (New Chip)

Figure 5-27 TPS76633 Power-Supply Ripple Rejection vs Frequency and Input Voltage (New Chip)

Figure 5-29 TPS76633 Output Spectral Noise Density vs Frequency and Load Current (New Chip)

Figure 5-31 TPS76633 Output Spectral Noise Density vs Frequency and Input Voltage (New Chip)

Figure 5-33 TPS76615 Line Transient Response (Legacy Chip)

Figure 5-35 TPS76633 Line Transient Response (New Chip)

Figure 5-37 TPS76615 Load Transient Response (Legacy Chip)

Figure 5-39 TPS76633 Load Transient Response (New Chip)

Figure 5-41 TPS76633 Output Voltage vs Time (Legacy Chip)

Start-up with EN sequencing

Figure 5-43 TPS76633 Output Voltage vs Time (New Chip)

Start-up with V_IN sequencing

Figure 5-45 TPS76633 Output Voltage vs Time (New Chip)