ZHCSCL5D january   2014  – may 2023 TPS65262

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Enable and Adjusting Undervoltage Lockout
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Power-Up Sequencing
        1. 7.3.4.1 External Power Sequencing
        2. 7.3.4.2 Automatic Power Sequencing
      5. 7.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 7.3.6  Out-of-Phase Operation
      7. 7.3.7  Output Overvoltage Protection (OVP)
      8. 7.3.8  PSM
      9. 7.3.9  Slope Compensation
      10. 7.3.10 Overcurrent Protection
        1. 7.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 7.3.11 Power Good
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 4.5 V (Minimum VIN)
      2. 7.4.2 Operation With EN Control
      3. 7.4.3 Operation at Light Loads
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Thermal Shutdown

The internal thermal shutdown circuitry forces the device to stop switching if the junction temperature exceeds 160°C typically. The device reinitiates the power up sequence when the junction temperature drops below 140°C typically.

Table 7-3 Related Parts
PART NUMBERDESCRIPTIONCOMMENTS
TPS652614.5- to 18-V, triple buck with input voltage power failure indicatorTriple buck 3-A/2-A/2-A output current, features an open drain RESET signal to monitor power down, automatic power sequencing
TPS652634.5- to 18-V, triple buck with I2C interfaceTriple buck 3-A/2-A/2-A output current, I2C controlled dynamic voltage scaling (DVS)
TPS652874.5- to 18-V, triple buck with power switch and push button controlTriple buck 3-A/2-A/2-A output current, up to 2.1-A USB power with over current setting by external resistor, push button control for intelligent system power-on/power-off operation
TPS652884.5- to 18-V, triple buck with dual power switchesTriple buck 3-A/2-A/2-A output current, 2 USB power switches current limiting at typical 1.2 A (0.8/1.0/1.4/1.6/1.8/2.0/2.2 A available with manufacture trim options)