ZHCSG04F january   2017  – may 2023 TPS65235-1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Boost Converter
      2. 7.3.2  Linear Regulator and Current Limit
      3. 7.3.3  Boost Converter Current Limit
      4. 7.3.4  Charge Pump
      5. 7.3.5  Slew Rate Control
      6. 7.3.6  Short-Circuit Protection, Hiccup, and Overtemperature Protection
      7. 7.3.7  Tone Generation
      8. 7.3.8  Tone Detection
      9. 7.3.9  Audio Noise Rejection
      10. 7.3.10 Disable and Enable
      11. 7.3.11 Component Selection
        1. 7.3.11.1 Boost Inductor
        2. 7.3.11.2 Capacitor Selection
        3. 7.3.11.3 Surge Components
        4. 7.3.11.4 Consideration for Boost Filtering and LNB Noise
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 TPS65235-1 I2C Update Sequence
    6. 7.6 Register Maps
      1. 7.6.1 Control Register 1 (address = 0x00) [reset = 0x08]
      2. 7.6.2 Control Register 2 (address = 0x01) [reset = 0x09]
      3. 7.6.3 Status Register (address = 0x02) [reset = 0x29]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DiSEqc1.x Support
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 DiSEqc2.x Support
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS65235-1UNIT
RUK (WQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance44.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance47.3°C/W
RθJBJunction-to-board thermal resistance16.5°C/W
ψJTJunction-to-top characterization parameter0.5°C/W
ψJBJunction-to-board characterization parameter16.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.