ZHCS089G February   2011  – September 2017 TPS65185

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用原理图
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  Active Discharge
      5. 8.3.5  VPOS/VNEG Supply Tracking
      6. 8.3.6  V3P3 Power Switch
      7. 8.3.7  VCOM Adjustment
        1. 8.3.7.1 Kick-Back Voltage Measurement
        2. 8.3.7.2 Storing the VCOM Power-Up Default Value in Memory
      8. 8.3.8  Fault Handling And Recovery
      9. 8.3.9  Power Good Pin
      10. 8.3.10 Interrupt Pin
      11. 8.3.11 Panel Temperature Monitoring
        1. 8.3.11.1 NTC Bias Circuit
        2. 8.3.11.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.11.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE) Register (address = 0x00h) [reset = N/A]
        1. Table 3. TMST_VALUE Register Field Descriptions
      2. 8.6.2  Enable (ENABLE) Register (address = 0x01h) [reset = 0h]
        1. Table 4. ENABLE Register Field Descriptions
      3. 8.6.3  Voltage Adjustment (VADJ) Register (address = 0x02h) [reset = 23h]
        1. Table 5. VADJ Register Field Descriptions
      4. 8.6.4  VCOM 1 (VCOM1) Register (address = 0x03h) [reset = 7Dh]
        1. Table 6. VCOM1 Register Field Descriptions
      5. 8.6.5  VCOM 2 (VCOM2) Register (address = 0x04h) [reset = 04h]
        1. Table 7. VCOM2 Register Field Descriptions
      6. 8.6.6  Interrupt Enable 1 (INT_EN1) Register (address = 0x05h) [reset = 7Fh]
        1. Table 8. INT_EN1 Register Field Descriptions
      7. 8.6.7  Interrupt Enable 2 (INT_EN2) Register (address = 0x06h) [reset = FFh]
        1. Table 9. INT_EN2 Register Field Descriptions
      8. 8.6.8  Interrupt 1 (INT1) Register (address = 0x07h) [reset = 0h]
        1. Table 10. INT1 Register Field Descriptions
      9. 8.6.9  Interrupt 2 (INT2) Register (address = 0x08h) [reset = N/A]
        1. Table 11. INT2 Register Field Descriptions
      10. 8.6.10 Power-Up Sequence 0 (UPSEQ0) Register (address = 0x09h) [reset = E4h]
        1. Table 12. UPSEQ0 Register Field Descriptions
      11. 8.6.11 Power-Up Sequence 1 (UPSEQ1) Register (address = 0x0Ah) [reset = 55h]
        1. Table 13. UPSEQ1 Register Field Descriptions
      12. 8.6.12 Power-Down Sequence 0 (DWNSEQ0) Register (address = 0x0Bh) [reset = 1Eh]
        1. Table 14. DWNSEQ0 Register Field Descriptions
      13. 8.6.13 Power-Down Sequence 1 (DWNSEQ1) Register (address = 0x0Ch) [reset = E0h]
        1. Table 15. DWNSEQ1 Register Field Descriptions
      14. 8.6.14 Thermistor 1 (TMST1) Register (address = 0x0Dh) [reset = 20h]
        1. Table 16. TMST1 Register Field Descriptions
      15. 8.6.15 Thermistor 2 (TMST2) Register (address = 0x0Eh) [reset = 78h]
        1. Table 17. TMST2 Register Field Descriptions
      16. 8.6.16 Power Good Status (PG) Register (address = 0x0Fh) [reset = 0h]
        1. Table 18. PG Register Field Descriptions
      17. 8.6.17 Revision and Version Control (REVID) Register (address = 0x10h) [reset = 45h]
        1. Table 19. REVID Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 第三方产品免责声明
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.6 Timing Requirements: Data Transmission

VBAT = 3.6 V ±5%, TA = 25ºC, CL = 100 pF (unless otherwise noted)
MIN NOM MAX UNIT
f(SCL) Serial clock frequency 100 400 kHz
tHD;STA Hold time (repeated) START condition. After this period, the first clock pulse is generated. SCL = 100 kHz 4 µs
SCL = 400 kHz 600 ns
tLOW LOW period of the SCL clock SCL = 100 kHz 4.7 µs
SCL = 400 kHz 1.3
tHIGH HIGH period of the SCL clock SCL = 100 kHz 4 µs
SCL = 400 kHz 600 ns
tSU;STA Set-up time for a repeated START condition SCL = 100 kHz 4.7 µs
SCL = 400 kHz 600 ns
tHD;DAT Data hold time SCL = 100 kHz 0 3.45 µs
SCL = 400 kHz 0 900 ns
tSU;DAT Data set-up time SCL = 100 kHz 250 ns
SCL = 400 kHz 100
tr Rise time of both SDA and SCL signals SCL = 100 kHz 1000 ns
SCL = 400 kHz 300
tf Fall time of both SDA and SCL signals SCL = 100 kHz 300 ns
SCL = 400 kHz 300
tSU;STO Set-up time for STOP condition SCL = 100 kHz 4 µs
SCL = 400 kHz 600 ns
tBUF Bus Free Time Between Stop and Start Condition SCL = 100 kHz 4.7 µs
SCL = 400 kHz 1.3
tSP Pulse width of spikes that must be suppressed by the input filter SCL = 100 kHz n/a n/a ns
SCL = 400 kHz 0 50
Cb Capacitive load for each bus line SCL = 100 kHz 400 pF
SCL = 400 kHz 400
TPS65185 TPS651851 i2c_data_transmission_lvsaq8.gifFigure 1. I2C Data Transmission Timing
TPS65185 TPS651851 tps65185x-power-up-and-power-down-timing-diagram.gif
1. Minimum delay time between WAKEUP rising edge and IC ready to accept I2C transaction.
2. The device does not enter the SLEEP state until the final discharge delay time has elapsed.

NOTE:

In this example, the first power-up sequence is started by pulling the PWRUP pin high (rising edge). Power-down is initiated by pulling the WAKEUP pin low (device enters sleep mode after rails are discharged). The second power-up sequence is initiated by pulling the WAKEUP pin high while the PWRUP pin is also high (power up from sleep to active).
Figure 2. Power-Up and Power-Down Timing Diagram